The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent

Waste Management

Volumn 33, Issue 2, 2013, Pages 484-488

  Zhu, P ^a   Chen, Y ^a   Wang, L Y ^a   Zhou, M ^b   Zhou, J ^c  

^a SHANGHAI UNIVERSITY   (China)

^b SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION   (China)

^c PEKING UNIVERSITY   (China)

Author keywords

Bromine epoxy resin; Dimethyl sulfoxide; Dissolution; Separation; Waste printed circuit board

Indexed keywords

DIMETHYL SULFOXIDE (DMSO); ENVIRONMENTAL POLLUTIONS; OPTIMUM CONDITIONS; SOLID-TO-LIQUID RATIO; WASTE PRINTED CIRCUIT BOARD;

BROMINE; DIMETHYL SULFOXIDE; EPOXY RESINS; LIQUIDS; ORGANIC SOLVENTS; PRINTED CIRCUIT BOARDS; RESINS; SEPARATION;

DISSOLUTION;

BROMINE EPOXY RESIN; DIMETHYL SULFOXIDE; ORGANIC SOLVENT; RESIN; UNCLASSIFIED DRUG;

DIMETHYLSULFIDE; DISSOLUTION; EXPERIMENTAL STUDY; POLLUTION CONTROL; POLYMER; SEPARATION; SOLID WASTE; WASTE TECHNOLOGY;

ARTICLE; CONCENTRATION PROCESS; DECOMPRESSION; DISSOLUTION; ELECTRONIC WASTE; PARAMETERS; PRIORITY JOURNAL; SEPARATION TECHNIQUE; SOLID TO LIQUID RATIO; TEMPERATURE; TIME; VAPOR; WASTE COMPONENT REMOVAL; WASTE MANAGEMENT; WASTE PRINTED CIRCUIT BOARD; WASTE PRINTED CIRCUIT BOARD SIZE;

BROMINE; COLD TEMPERATURE; DIMETHYL SULFOXIDE; ELECTRONIC WASTE; EPOXY RESINS; RECYCLING; REFUSE DISPOSAL; SOLVENTS;

EID: 84874329215     PISSN: 0956053X     EISSN: 18792456     Source Type: Journal    
DOI: 10.1016/j.wasman.2012.10.003     Document Type: Article

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