Processing TSV wafer with stealth dicing technology

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Volumn , Issue , 2012, Pages 271-273

  Chen, Wan Ting ^a   Lee, Mei Chin ^a   Lin, Chun Tang ^a   Yang, Ming Hsien ^a   Lai, Jeng Yuan ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BETTER PERFORMANCE; BOTTOM SURFACES; CHIP SEPARATION; CRITICAL CHALLENGES; DICING METHOD; DOUBLE SIDES; DRY PROCESS; FOCAL POINTS; LASER DYNAMICS; MODIFIED LAYER; RELIABILITY FAILURE; SEAL RINGS; SMOOTH SURFACE; STUDY METHODS; THROUGH-SILICON-VIA (TSV); ULTRA-THIN; WAFER DICING; WARPAGES; YIELD LOSS;

DELAY CIRCUITS; MICROSYSTEMS; STEALTH TECHNOLOGY; TECHNOLOGY;

SEALS;

EID: 84874265223     PISSN: 21505934     EISSN: 21505942     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2012.6420262     Document Type: Conference Paper

References (5)

1. Vittu, J.,. et al., Damage-free dicing of low-k wafers. Future Fab. Intl. 17, June 21, 2004.
2. F. Fukuyo. et al., The stealth dicing technologies and their applications. Journal of Japan Laser Processing Society, vol. 12, No. 1, pp. 17-23, 2005.
3. C. Hermanns, Laser separation of flat glass. In Proceedings of the 63th the Laser Materials Processing Conference, pp 105-109, 2005.
4. P. Chall, ALSI's Low Power Multiple Beam Technology for High Throughput and Low Damage Wafer Dicing. In Proceedings of the 65th The Laser Materials Processing Conference, pp 211-215, 2006.
5. M. Kumagai. et al., Advanced Dicing Technology for Semiconductor Wafer-Stealth Dicing. IEEE Transactions on Semiconductor Manufacturing 20, pp 259-265, 2007.