High performance self-healing bismaleimide/diallylbisphenol a/poly(phenylene oxide) microcapsules composites with low temperature processability

Polymer Composites

Volumn 34, Issue 3, 2013, Pages 335-342

  Lin, Chao ^a   Yuan, Li ^a   Gu, Aijuan ^a   Liang, Guozheng ^a   Wu, Jianyuan ^a  

^a SOOCHOW UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BISMALEIMIDES; BISMALEIMIDODIPHENYLMETHANE; CONTACT AREAS; CORE MATERIAL; CRACK SURFACES; DYNAMIC MECHANICAL PROPERTY; HIGH-GLASS TRANSITION TEMPERATURES; LOW TEMPERATURES; LOW-DIELECTRIC PROPERTIES; MICROCAPSULES; POLYMERIZATION REACTION; PROCESSABILITY; RESIN SYSTEMS; SCANNING ELECTRONIC MICROSCOPES; SELF-HEALING; SELF-HEALING ABILITIES;

COREMAKING; CURING; EPOXY RESINS; MECHANICAL PROPERTIES; POLYMERIZATION; POLYPHENYLENE OXIDES; RESINS; TEMPERATURE;

DIELECTRIC PROPERTIES;

EID: 84874115152     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.22420     Document Type: Article

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