Thermally cleavable epoxy resins for electronic and optoelectronic applications

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 425-428

  Chiu, C S ^a   Lin, J M ^a   Chen, Y K ^a   Wu, S H ^a   Peng, B S ^a   Hsu, K Y ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; FLIP CHIP DEVICES;

ADHESIVE FORMULATION; CHIP REMOVAL; CLEANABILITY; FLIP CHIP TECHNOLOGIES; OPTOELECTRONIC APPLICATIONS; PROCESSABILITY; REWORKABILITY; UNDERFILLS;

CHIP SCALE PACKAGES;

EID: 84873999650     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271559     Document Type: Conference Paper

References (9)

1. Seraphim, D. P.; Barr, D. E.; Chen, W. T.; Schmitt, G. P., Microelectronics Packaging Handbook; Tummala, R. R., Rymaszewski, E. J., Klopfenstein, A., Eds.; Chapman & Hall (New York, 1997), part 3, chap. 17, p. 290.
2. Bauer, R. S., Polymers for Electronic and Photonic Applications, Wong, C. P., Ed.; Academic Press (San Diego, 1993), p. 287.
3. Griffith, J. R., Org Coat Plast, 1978, 39, 209.
4. Tesoro, G. C. and Sastri, V., J Appl Polym Sci, 1990, 39,1425
5. Buchwalter, S. L. and Kosbar, L. L., J Polym Sci, Part A, Polym Chem, 1996, 34, 249.
6. Yang, S., Chen, J., Korner, H. Breiner, T. and Ober, C. K., Polym Prepr Div, Polym Chem, Am Chem Soc, 1997, 38, 440.
7. Wang, L. and Wong, C. P., J Polym Sci, Part A, Polym Chem, 1999, 37, 2991.
8. Wang, L., Li, H. and Wong, C. P., J Polym Sci, Part A, Polym Chem, 2000, 38, 3771.
9. Wang, L. and Wong, J App Polym Sci, 2001, 81, 1868.