Scaling effects on grain boundary diffusivity; Au in Cu

Acta Materialia

Volumn 61, Issue 6, 2013, Pages 1851-1861

  Tai, Kaiping ^a   Dillon, Shen J ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Copper alloys; Grain boundary diffusion; Nanocrystalline microstructure; Scanning transmission electron microscopy; Secondary ion mass spectroscopy

Indexed keywords

APPROPRIATE MODELS; COARSE-GRAINED; COMPOSITION PROFILE; CU THIN FILM; DEPTH PROFILE; DIFFUSION EQUATIONS; EXPERIMENTAL DATUM; FINITE-ELEMENT; GRAIN BOUNDARY DIFFUSIVITY; GRAIN SIZE; GRAIN-BOUNDARY DIFFUSION; NANOCRYSTALLINE MICROSTRUCTURES; NANOCRYSTALLINES; SCALING EFFECTS; SECONDARY ION MASS SPECTROSCOPY; STRESS GRADIENT; THIN FILM MATERIAL;

COPPER ALLOYS; DIFFUSION; ELECTRON MICROSCOPY; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; NANOCRYSTALLINE MATERIALS; PARTIAL DIFFERENTIAL EQUATIONS; SECONDARY ION MASS SPECTROMETRY;

GRAIN BOUNDARIES;

EID: 84873994264     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.12.006     Document Type: Article

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