Thermal flow sensors on flexible substrates for minimally invasive medical instruments

Proceedings of IEEE Sensors

Volumn , Issue , 2012, Pages

  Mimoun, B ^a   Van Der Horst, A ^a,b   Dekker, R ^a,c   Van Der Voort, D ^b   Rutten, M ^b   Van De Vosse, F ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BLOOD FLOW; BOND PAD; CONSTANT POWER; DYNAMIC FLOW CONDITIONS; FLEXIBLE SUBSTRATE; FLOW CHANNELS; FLOW DIRECTION; FLOW-SENSORS; GUIDEWIRES; INTRAVASCULAR; MEDICAL INSTRUMENTS; MINIMALLY INVASIVE; PRINTED CIRCUIT BOARDS (PCB); SILICON CHIP; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL FLOW SENSOR; WIRE BONDING;

POLYIMIDES; SENSORS;

THERMOPILES;

EID: 84873974557     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2012.6411429     Document Type: Conference Paper

References (12)

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