Deposition of hydrophobic functional groups on wood surfaces using atmospheric-pressure dielectric barrier discharge in helium-hexamethyldisiloxane gas mixtures

Plasma Processes and Polymers

Volumn 9, Issue 11-12, 2012, Pages 1168-1175

  Levasseur, Olivier ^a   Stafford, Luc ^a   Gherardi, Nicolas ^b,c   Naudé, Nicolas ^b,c   Blanchard, Vincent ^d   Blanchet, Pierre ^d   Riedl, Bernard ^e   Sarkissian, Andranik ^f  

^a UNIVERSITÉ DE MONTRÉAL   (Canada)

^b d'Hydraulique et des Telecommunications   (France)

^c CNRS   (France)

^d FPINNOVATIONS   (Canada)

^e UNIVERSITÉ LAVAL   (Canada)

^f Plasmionique Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ACER SACCHARUM; ATTENUATED TOTAL REFLECTANCE FOURIER TRANSFORM INFRARED; BAND INTENSITY RATIO; BLACK SPRUCE; DIELECTRIC BARRIER DISCHARGES; DISCHARGE REGIMES; DISCHARGE STABILITY; FUNCTIONALIZATIONS; GLASS SAMPLES; HEXAMETHYL DISILOXANE; HYDROPHOBIC FUNCTIONAL GROUPS; NATURAL AGING; PEAK-TO-PEAK VOLTAGES; PICEA MARIANA; SHARP CONTRAST; SPECTROSCOPY MEASUREMENTS; SUGAR MAPLE; SURFACE WETTABILITY; THICK COATINGS; TREATMENT TIME; WATER CONTACT ANGLE; WOOD SAMPLES; WOOD SURFACES;

CONTACT ANGLE; DIELECTRIC DEVICES; EMISSION SPECTROSCOPY; FLOW CONTROL; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GAS MIXTURES; HELIUM; HYDROPHOBICITY; PLASMA STABILITY; PLASMAS; SILICON; WOOD PRODUCTS;

ELECTRIC DISCHARGES;

CONTACT ANGLE; ELECTRIC DISCHARGE; EMISSION SPECTROSCOPY; FLOW CONTROL; GAS; HELIUM; MIXTURES; PLASMA; SILICON; WOOD PRODUCTS;

EID: 84872327593     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201100222     Document Type: Article

References (29)

1. A. S. Ross, W. C. Feist, Am. Paint Coat. J. 1993, 78, 41.
2. P. D. Evan, A. J. Michell, K. J. Schmalzl, Wood Sci. Technol. 1992, 26, 151.
3. M. Pétrissans, P. Gérardin, I. El Bakali, M. Serraj, Holzforschung 2003, 57, 301.
4. P. Bekhta, P. Niemz, Holzforschung 2003, 57, 539.
5. M. V. Cristea, B. Riedl, P. Blanchet, Prog. Org. Coat. 2010, 69, 432.
6. E. M. Moser, C. Müller, J. Mater. Sci. 1999, 34, 349.
7. D. Hegemann, H. Brunner, C. Oehr, Nucl. Inst. Methods Phys. Res. B 2003, 208, 281.
8. L. Podgorski, B. Chevet, L. Onic, A. Merlin, Int. J. Adhes. Adhes. 2000, 20, 103.
9. W. L. E. Magalhaes, M. F. de Souza, Surf. Coat. Technol. 2002, 155, 11.
10. R. Mahlberg, H. E.-M. Niemi, F. Denes, R. M. Rowell, Int. J. Adhes. Adhes. 1998, 18, 283.
11. P. Favia, R. d'Agostino, Surf. Coat. Technol. 1998, 98, 1102.
12. D. Hegemann, H. Brunner, C. Oehr, Plasma Polym. 2002, 6, 221.
13. P. Rehn, W. Viöl, Holz als Roh-und Werkstoff 2003, 61, 145.
14. A. R. Denes, M. A. Tshabalala, R. Rowell, F. Denes, R. A. Young, Holzforschung 1999, 53, 318.
15. S. Zanini, C. Riccardi, M. Orlandi, V. Fornara, M. P. Colombini, D. I. Donato, S. Legnaiolo, V. Palleschi, Wood Sci. Technol. 2008, 42, 149.
16. M. Strobel, C. S. Lyons, Plasma Process. Polym. 2011, 8, 8.
17. R. Di Mundo, F. Palumbo, Plasma Process. Polym. 2011, 8, 14.
18. F. Massines, N. Gherardi, N. Naudé, P. Ségur, Plasma Phys. Controlled Fusion 2005, 47, B577.
19. F. Massines, N. Gherardi, N. Naudé, P. Ségur, Eur. Phys. J. Appl. Phys. 2009, 47, 22805.
20. M. Asandulesa, I. Topala, N. Dumitrascu, Holzforschung 2010, 64, 223.
21. F. Massines, P. Ségur, N. Gherardi, C. Khamphan, A. Ricard, Surf. Coat. Technol. 2003, 174-175, 8.
22. I. Topala, N. Dumitrascu, J. Adhes. Sci. Technol. 2007, 21, 1089.
23. A. Wolkenhauer, G. Avramidis, E. Hauswald, H. Militz, W. Viol, Int. J. Adhes. Adhes. 2009, 29, 18.
24. Y. Akishev, et al., J. Phys. D: Appl. Phys. 2008, 41, 235203.
25. R. Morent, et al., Plasma Process. Polym. 2009, 6, S537.
26. K. K. Pandey, J. Appl. Polym. Sci. 1999, 71, 1969.
27. A. Awal, M. Sain, J. Appl. Polym. Sci. 2011, 122, 956.
28. J. Fang, H. Chen, X. Yu, J. Appl. Polym. Sci. 2001, 80, 1434.
29. R. P. Mota, D. Galvao, S. F. Durrant, M. A. Bica de Moraes, S. O. Dantas, M. Cantao, Thin Solid Films 1995, 270, 109.