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Polymers for Advanced Technologies

Volumn 24, Issue 1, 2013, Pages 81-89

Novel polyphenylene oxide microcapsules filled with epoxy resins

(7) Yuan, Li a Gu, Aijuan a Nutt, Steven b Wu, Jianyuan a Lin, Chao a Chen, Feng a Liang, Guozheng a

a SOOCHOW UNIVERSITY (China)

b College of Chemistry Chemical Engineering and Materials Science Soochow University ^* (United States)

Author keywords

Epoxy resin; Microencapsulation; Morphology; Polymerization; Thermal properties

Indexed keywords

BISMALEIMIDODIPHENYL METHANES; CORE MATERIAL; CURING AGENTS; DIALLYLBISPHENOL A; DIGLYCIDYL ETHER OF BISPHENOL-A; HIGH THERMAL STABILITY; IN-SITU POLYMERIZATION; LASER SCANNING CONFOCAL MICROSCOPY; MATRIX CRACK; MICROCAPSULES; MICROENCAPSULATION; PROCESSING PARAMETERS; RAMAN MICROSCOPE; REACTION TEMPERATURE; SHELL MATERIALS; WEIGHT RATIOS;

CONFOCAL MICROSCOPY; COREMAKING; DIFFERENTIAL SCANNING CALORIMETRY; ENCAPSULATION; EPOXY RESINS; ETHERS; MECHANICAL PROPERTIES; MORPHOLOGY; OPTICAL MICROSCOPY; PHENOLS; POLYMERIZATION; POLYPHENYLENE OXIDES; SCANNING ELECTRON MICROSCOPY; SURFACE ACTIVE AGENTS; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS; THERMOSETS;

RESINS;

EID: 84871705804 PISSN: 10427147 EISSN: 10991581 Source Type: Journal
DOI: 10.1002/pat.3053 Document Type: Article

Times cited : (18)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.