Computer engineering: Feeling the heat

Nature

Volumn 492, Issue 7428, 2012, Pages 174-176

  Ball, Philip ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED TECHNOLOGY; COMPUTER; COMPUTER SIMULATION; COOLING; HEAT FLUX; HIGH TEMPERATURE; RESEARCH WORK; SOFTWARE; TWO-DIMENSIONAL MODELING;

COMPUTER; COOLING; ELECTRIC CURRENT; ELECTROCHEMISTRY; ELECTRODE; ENERGY CONSUMPTION; ENGINEERING; ENVIRONMENTAL TEMPERATURE; EQUIPMENT DESIGN; FACILITATED COMMUNICATION; HUMAN; MICROFLUIDICS; MICROPROCESSOR; PRIORITY JOURNAL; SEMICONDUCTOR; SHORT SURVEY; TEMPERATURE SENSITIVITY;

BAVARIA; GERMANY; MUNICH; PENNSYLVANIA; PHILADELPHIA; UNITED STATES;

EID: 84871023816     PISSN: 00280836     EISSN: 14764687     Source Type: Journal    
DOI: 10.1038/492174a     Document Type: Short Survey

References (6)

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2. Chu, R. C., Simons, R. E., Ellsworth, M. J., Schmidt, R. R. & Cozzolino, V. IEEE Trans. Device Mater. Reliability 4, 568-585 (2004).
3. Ellsworth, M. J. et al. ITHERM 266-274 (2008).
4. Shaegh, S. A. M., Nguyen, N.-T. & Chan, S. H. Int. J. Hydrogen Energ. 36, 5675-5694 (2011).
5. Ruch, P. W., Rapp, T., Schmidt, T. J. & Michel, B. Studies of power density in microfluidic redox flow cells. Abstract presented at the 63rd Annual Meeting of the International Society of Electrochemistry (2012).
6. Ruch, P., Brunschwiler, T., Escher, W., Paredes, S. & Michel, B. IBM J. Res. & Dev. 55, 593-605 (2011).