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Volumn , Issue , 1992, Pages

Wiring and crosstalk avoidance in multi-chip module design

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK AVOIDANCE; NOISE LIMIT; THIN FILM LAYERS; WIRE LENGTH;

EID: 84870002110     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.1992.591865     Document Type: Conference Paper
Times cited : (26)

References (9)
  • 1
    • 0019938871 scopus 로고
    • Thermal conduction module: A high-performance multilayer ceramic package
    • January
    • A. Boldgett and D. Barbour, "Thermal conduction module: a high-performance multilayer ceramic package," IBM Journal of Research and Development, vol. 26, no. 1, pp. 30-36, January 1982.
    • (1982) IBM Journal of Research and Development , vol.26 , Issue.1 , pp. 30-36
    • Boldgett, A.1    Barbour, D.2
  • 2
    • 0019930797 scopus 로고
    • A conduction-cooled module for high-performance LSI devices
    • January
    • S. Oktay and H. Kammerer, "A conduction-cooled module for high-performance LSI devices," IBM Journal of Research and Development, vol. 26, no. 1, pp. 55-66, January 1982.
    • (1982) IBM Journal of Research and Development , vol.26 , Issue.1 , pp. 55-66
    • Oktay, S.1    Kammerer, H.2
  • 3
    • 0026171573 scopus 로고
    • Electronic packaging in the 1990's - A perspective from America
    • June
    • R. Tummala, "Electronic packaging in the 1990's - a perspective from America," IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol. 14, no. 2, pp. 262-271, June 1991.
    • (1991) IEEE Trans. Components, Hybrids, and Manufacturing Technology , vol.14 , Issue.2 , pp. 262-271
    • Tummala, R.1
  • 6
    • 0022795973 scopus 로고
    • GLITTER: A gridless variable-width channel router
    • October
    • H. Chen and E. Kuh, "GLITTER: A gridless variable-width channel router," IEEE Trans. Computer-Aided Design, vol. CAD-5, no. 4, pp. 459-465, October 1986.
    • (1986) IEEE Trans. Computer-Aided Design , vol.CAD-5 , Issue.4 , pp. 459-465
    • Chen, H.1    Kuh, E.2
  • 8
    • 0020127007 scopus 로고
    • Electrical design of a high speed computer package
    • May
    • E. Davidson, "Electrical design of a high speed computer package," IBM Journal of Research and Development, vol. 26, no. 3, pp. 349-361, May 1982.
    • (1982) IBM Journal of Research and Development , vol.26 , Issue.3 , pp. 349-361
    • Davidson, E.1
  • 9
    • 0020126693 scopus 로고
    • The thin-film module as a high performance semiconductor package
    • May
    • C. Ho, D. Chance, C. Bajorek, and R. Acosta, "The thin-film module as a high performance semiconductor package," IBM Journal of Research and Development, vol. 26, no. 3, pp. 286-296, May 1982.
    • (1982) IBM Journal of Research and Development , vol.26 , Issue.3 , pp. 286-296
    • Ho, C.1    Chance, D.2    Bajorek, C.3    Acosta, R.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.