-
1
-
-
0019938871
-
Thermal conduction module: A high-performance multilayer ceramic package
-
January
-
A. Boldgett and D. Barbour, "Thermal conduction module: a high-performance multilayer ceramic package," IBM Journal of Research and Development, vol. 26, no. 1, pp. 30-36, January 1982.
-
(1982)
IBM Journal of Research and Development
, vol.26
, Issue.1
, pp. 30-36
-
-
Boldgett, A.1
Barbour, D.2
-
2
-
-
0019930797
-
A conduction-cooled module for high-performance LSI devices
-
January
-
S. Oktay and H. Kammerer, "A conduction-cooled module for high-performance LSI devices," IBM Journal of Research and Development, vol. 26, no. 1, pp. 55-66, January 1982.
-
(1982)
IBM Journal of Research and Development
, vol.26
, Issue.1
, pp. 55-66
-
-
Oktay, S.1
Kammerer, H.2
-
3
-
-
0026171573
-
Electronic packaging in the 1990's - A perspective from America
-
June
-
R. Tummala, "Electronic packaging in the 1990's - a perspective from America," IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol. 14, no. 2, pp. 262-271, June 1991.
-
(1991)
IEEE Trans. Components, Hybrids, and Manufacturing Technology
, vol.14
, Issue.2
, pp. 262-271
-
-
Tummala, R.1
-
4
-
-
0024890435
-
Multi chip modules
-
R. Bruce, W. Meuli, and J. Ho, "Multi chip modules," in Proceedings, 26th Design Automation Conference, Las Vegas, NV, June 1989, pp. 389-393.
-
Proceedings, 26th Design Automation Conference, Las Vegas, NV, June 1989
, pp. 389-393
-
-
Bruce, R.1
Meuli, W.2
Ho, J.3
-
5
-
-
0024933489
-
Automatic layout of silicon-on-silicon hybrid packages
-
B. Preas, M. Pedram, and D. Curry, "Automatic layout of silicon-on-silicon hybrid packages," in Proceedings, 26th Design Automation Conference, Las Vegas, NV, June 1989, pp. 394-399.
-
Proceedings, 26th Design Automation Conference, Las Vegas, NV, June 1989
, pp. 394-399
-
-
Preas, B.1
Pedram, M.2
Curry, D.3
-
6
-
-
0022795973
-
GLITTER: A gridless variable-width channel router
-
October
-
H. Chen and E. Kuh, "GLITTER: A gridless variable-width channel router," IEEE Trans. Computer-Aided Design, vol. CAD-5, no. 4, pp. 459-465, October 1986.
-
(1986)
IEEE Trans. Computer-Aided Design
, vol.CAD-5
, Issue.4
, pp. 459-465
-
-
Chen, H.1
Kuh, E.2
-
7
-
-
0019701713
-
Crosstalk in multilayer ceramic packaging
-
C. Chang, G. Crowder, and M. McAllister, "Crosstalk in multilayer ceramic packaging," in Proceedings, International Symposium on Circuits and Systems, 1981, pp. 6-11.
-
Proceedings, International Symposium on Circuits and Systems, 1981
, pp. 6-11
-
-
Chang, C.1
Crowder, G.2
McAllister, M.3
-
8
-
-
0020127007
-
Electrical design of a high speed computer package
-
May
-
E. Davidson, "Electrical design of a high speed computer package," IBM Journal of Research and Development, vol. 26, no. 3, pp. 349-361, May 1982.
-
(1982)
IBM Journal of Research and Development
, vol.26
, Issue.3
, pp. 349-361
-
-
Davidson, E.1
-
9
-
-
0020126693
-
The thin-film module as a high performance semiconductor package
-
May
-
C. Ho, D. Chance, C. Bajorek, and R. Acosta, "The thin-film module as a high performance semiconductor package," IBM Journal of Research and Development, vol. 26, no. 3, pp. 286-296, May 1982.
-
(1982)
IBM Journal of Research and Development
, vol.26
, Issue.3
, pp. 286-296
-
-
Ho, C.1
Chance, D.2
Bajorek, C.3
Acosta, R.4
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