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Volumn , Issue , 1989, Pages 389-393
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Multichip modules
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
INTEGRATED CIRCUIT MANUFACTURE;
LITHOGRAPHY;
FINE-LINE LITHOGRAPHY;
HEAT REMOVAL;
IC ATTACHMENT;
MULTICHIP MODULES;
ELECTRONICS PACKAGING;
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EID: 0024890435
PISSN: 0738100X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1145/74382.74447 Document Type: Conference Paper |
Times cited : (14)
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References (15)
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