Through-thickness thermoelectric power of a carbon fiber/epoxy composite and decoupled contributions from a lamina and an interlaminar interface

Carbon

Volumn 52, Issue , 2013, Pages 30-39

  Han, Seungjin ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKFLOW; BISMUTH TELLURIDE; COMPOSITE LAMINATE; CROSS-PLY; CURING PRESSURE; ELECTRICAL CONTACTS; INTERLAMINAR; INTERLAMINAR INTERFACE; NEGATIVE VALUES; POSITIVE VALUE; SEEBECK VOLTAGE;

BISMUTH COMPOUNDS; CARBON; FILLERS; TELLURIUM; TELLURIUM COMPOUNDS; THERMOELECTRIC POWER;

LAMINATED COMPOSITES;

EID: 84869504721     PISSN: 00086223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.carbon.2012.08.071     Document Type: Article

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