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Volumn , Issue , 2012, Pages 442-447

Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells

Author keywords

metallic contacts; multicrystalline silicon solar cells; residual stress

Indexed keywords

BACK CONTACT; FRACTURE RATES; IN-SITU BENDING TESTS; LASER SCANNING DEVICE; MECHANICAL STRESS; METALLIC CONTACTS; MULTI-CRYSTALLINE SILICON SOLAR CELLS; PROCESSING STEPS; SCREEN-PRINTED SOLAR CELLS; STRESS GRADIENT; SYNCHROTRON DIFFRACTION; SYNCHROTRON MEASUREMENTS; WAFER STRENGTH; WAFER THICKNESS;

EID: 84869412268     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2012.6317653     Document Type: Conference Paper
Times cited : (4)

References (4)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.