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Volumn , Issue , 2012, Pages 442-447
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Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells
b
TNO
(Netherlands)
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Author keywords
metallic contacts; multicrystalline silicon solar cells; residual stress
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Indexed keywords
BACK CONTACT;
FRACTURE RATES;
IN-SITU BENDING TESTS;
LASER SCANNING DEVICE;
MECHANICAL STRESS;
METALLIC CONTACTS;
MULTI-CRYSTALLINE SILICON SOLAR CELLS;
PROCESSING STEPS;
SCREEN-PRINTED SOLAR CELLS;
STRESS GRADIENT;
SYNCHROTRON DIFFRACTION;
SYNCHROTRON MEASUREMENTS;
WAFER STRENGTH;
WAFER THICKNESS;
ALUMINUM;
FIRING (OF MATERIALS);
POLYSILICON;
RESIDUAL STRESSES;
SILICON WAFERS;
SILVER;
STRESS MEASUREMENT;
X RAY DIFFRACTION;
SILICON SOLAR CELLS;
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EID: 84869412268
PISSN: 01608371
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/PVSC.2012.6317653 Document Type: Conference Paper |
Times cited : (4)
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References (4)
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