Effect of silicon solar cell processing parameters and crystallinity on mechanical strength

Solar Energy Materials and Solar Cells

Volumn 95, Issue 1, 2011, Pages 97-100

  Popovich, V A ^a   Yunus, A ^a   Janssen, M ^a   Richardson, I M ^a   Bennett, I J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b TNO   (Netherlands)

Author keywords

Crystallinity; Fracture strength of silicon solar cell; Processing conditions

Indexed keywords

ALUMINUM PASTE; CRYSTALLINITIES; FRACTURE BEHAVIOR; FRACTURE STRENGTHS; GRAIN SIZE; INFLUENCING FACTOR; MECHANICAL STRENGTH; METALLIZATIONS; PROCESSING CONDITIONS; PROCESSING STEPS; SOLAR CELL PROCESSING; SOLAR MODULE; TRIPLE JUNCTION; WAFER STRENGTH; WAFER THICKNESS;

BENDING STRENGTH; BIOINFORMATICS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; SEMICONDUCTING SILICON COMPOUNDS; SILICON SOLAR CELLS; SILICON WAFERS; SOLAR CELLS;

FRACTURE;

EID: 78149361356     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2010.04.038     Document Type: Conference Paper

References (6)

1. ASTM C 1161-02c, Standard Test Method for Flexural Strength of Advance Ceramics at Ambient Temperature, 2008.
2. ASTM C 1341-06, Standard Test Method for Flexural properties of continuous Fiber-reinforces Advance Ceramic Composites, current edition, 2006.
3. James M. Gere, and Barry J. Goodno Mechanics of Materials seventh ed. 2009 Cengange Learning USA
4. Przemyslaw Rupnowski, Bhusan Sopori, Strength of silicon wafer: fracture mechanics approach, Springer Science/Business Media B.V., 2009.
5. R.F Cook Strength and sharp contact fracture of silicon J. Mater. Sci. 41 2006 841 872
6. V.A. Popovich, T. van Amstel, I.J. Bennett, M. Janssen, I.M. Richardson, Microstructure and mechanical properties of aluminum back contact layers, in: Proceedings of the 24th (EPSEC) Hamburg, Germany, 2009