Enhanced thermal conductivity of nano-SiC dispersed water based nanofluid

Bulletin of Materials Science

Volumn 35, Issue 5, 2012, Pages 707-712

  Manna, O ^a   Singh, S K ^b   Paul, G ^c  

^a HALDIA INSTITUTE OF TECHNOLOGY   (India)

^b CSIR INSTITUTE OF MINERALS AND MATERIALS TECHNOLOGY   (India)

^c INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Nanofluid; Nanoparticle; SiC; Thermal conductivity

Indexed keywords

CERAMIC NANOPARTICLES; CLOSED LOOPS; ENHANCED THERMAL CONDUCTIVITY; HEAT TRANSFER APPLICATIONS; INVERSE DEPENDENCE; NANO-SIC; NANOFLUIDS; SIC; THERMAL CONDUCTIVITY RATIO; TRANSIENT HOT WIRE; WATER BASED;

DISPERSIONS; NANOPARTICLES; SILICON CARBIDE; THERMAL CONDUCTIVITY;

NANOFLUIDICS;

EID: 84868244562     PISSN: 02504707     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12034-012-0366-7     Document Type: Article

References (21)

1. Challoner A R and Powell R W 1956 Proc. R. Soc. London Ser A 238 90
2. Chen G 1996 ASME J. Heat Transf. 118 539
3. Chopkar M, Das P K and Manna I 2006 Scr. Mater. 55 549
4. Chopkar M, Kumar S, Bhandari D R, Das P K and Manna I 2007 Mater. Sci. Eng. B139 141
5. Das S K, Putra N, Theisen P and Roetzel W 2003 ASME J. Heat Transf. 125 567
6. Eastman J A, Choi S U S, Li S, Yu W and Thompson L J 2001 Appl. Phys. Lett. 78 718
7. Fecht H J 2002 in Nanostructured materials (ed.) C C Koch (New York: Noyes Publications) p. 73
8. He Y, Jin Y, Chen H, Ding Y, Cang D and Lu H 2007 Int. J. Heat Mass Transf. 50 2272
9. Kim S H, Choi S R and Kim N 2007 J. Heat Transf. 129 298
10. Lee S, Choi S U S, Li S and Eastman J A 1999 ASME J. Heat Transf. 121 280
11. Manna I, Das P K and Chopkar M 2005 Patent Application filed in India, 390/KOL/2005
12. Patel H E, Das S K, Sundararajan T, Nair A S, George B and Pradeep T 2003 Appl. Phys. Lett. 83 2931
13. Paul G, Chopkar M, Das P K and Manna I 2010a Renew. Sust. Energ. Rev. 14 1913
14. Paul G, Pal T and Manna I 2010b J. Colloid Interf. Sci. 349 434
15. Paul G, Philip J, Raj B, Das P K andManna I 2011 Int. J. Heat Mass Transf. 54 3783
16. Suryanarayana C 2001 Prog. Mater. Sci. 46 1
17. Wang X, Xu X and Choi S U S 1999 J. Thermophys. Heat Transf. 13 474
18. Wang B X, Zhou P L and Pang X F 2003 Int. J. Heat Mass Transf. 46 3639
19. Xie H, Wang J, Xi T and Liu Y 2002 Int. J. Thermophys. 23 571
20. Xie Z, Ma J, Xu Q and Chang Y 2004 Ceram. Int. 30 219
21. Xuan Y and Li Q 2000 Int. J. Heat Fluid Flow 21 58