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Volumn 27, Issue 5, 2012, Pages 388-392

Development of low thermal expansion Sc 2(WO 4) 3 containing composites

Author keywords

Composites; Low thermal expansion; Sc 2(WO 4) 3

Indexed keywords

CERAMIC SUBSTRATES; CO-SINTERING; LOW THERMAL EXPANSION; NEGATIVE THERMAL EXPANSION; OPTICAL FIBRE GRATINGS; SOLID STATE METHOD; THERMAL EXPANSION COEFFICIENTS; TRANSIENT TEMPERATURE; ZERO EXPANSION; ZERO THERMAL EXPANSION;

EID: 84868007271     PISSN: 10667857     EISSN: 17535557     Source Type: Journal    
DOI: 10.1179/1066785712Z.00000000094     Document Type: Article
Times cited : (17)

References (35)
  • 28
    • 0029227455 scopus 로고
    • High conductivity material for electronic thermal management
    • Las Vegas, NV, USA, May, IEEE
    • S. Jha: 'High conductivity material for electronic thermal management', Proc. 45th Electronic Components and Technology Conf., Las Vegas, NV, USA, May 1995, IEEE, 542-547.
    • (1995) Proc. 45th Electronic Components and Technology Conf. , pp. 542-547
    • Jha, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.