Packaging substrate applications of ultra low CTE polyimide

Journal of Photopolymer Science and Technology

Volumn 25, Issue 3, 2012, Pages 359-364

  Tsuchiya, Toshiyuki ^a   Maeda, Satoshi ^a   Tsiikada, Yutaka ^b  

^a TOYOBO CO LTD   (Japan)

^b i PACKS   (Japan)

Author keywords

Laminate sheet; Package substrate; Polyimide film; Reliability; Ultra low CTE

Indexed keywords

EID: 84867865321     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.25.359     Document Type: Article

References (3)

1. "Japan Jisso Technology Roadmap 2011 ", Japan Electronics & Information Technology Industries Association, 2011, p. 14
2. K. Yamanaka et.al, Proceedings of 2009 Electronic Components and Technology Conference (2009), 325
3. S. Maeda, J. Photopolymer Sci. and Technol., 21(1) (2008), 95.