A new thermally stable polyimide film for advanced microelectronics packaging

Journal of Photopolymer Science and Technology

Volumn 21, Issue 1, 2008, Pages 95-99

  Maeda, Satoshi ^a  

^a TOYOBO CO LTD   (Japan)

Author keywords

Coefficient of thermal expansion; Package substrate; Polyimide film

Indexed keywords

EID: 49049093413     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.21.95     Document Type: Article

References (5)

1. Japan Jisso Technology Roadmap 2007, Japan Electronics & Information Technology Industries Association, (2007) p147.
2. For example, Y.Tukada, Intoroduction to Build-up Print Wiring Board, Nikkan Kogyo Shimbun, Ltd.,(1998) pp26-30.
3. The Current and Future Prospect in Embedded Passive and Active Device Substrate, Journal of Japan Institute of Electronics Packaging, vol.11, No.1 (2008) p14.
4. http://www2.dupont.com/Kapton/en_US/index.html
5. http://www.ube-ind.co.jp/japanese/products/fine/fine_01_01.htm