Development of poly(dimethylsiloxane)-titania nanocomposites with controlled dielectric properties: Effect of heat treatment of titania on electrical properties

Journal of Applied Polymer Science

Volumn 127, Issue 1, 2013, Pages 784-796

  Nayak, Suryakanta ^a   Rahaman, Mostafizur ^a   Pandey, A K ^b   Setua, Dipak Kumar ^b   Chaki, Tapan Kumar ^a   Khastgir, Dipak ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

^b DEFENCE MATERIALS AND STORES RESEARCH AND DEVELOPMENT ESTABLISHMENT   (India)

Author keywords

electrical properties; heat treatment; mechanical properties; nanocomposites; silicone; titania

Indexed keywords

BASE MATRIX; ELECTRICAL AND MECHANICAL PROPERTIES; ELONGATION AT BREAK; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FILLER DISPERSION; FILLER LOADING; PHYSISORBED; POLYMER CERAMIC COMPOSITE; TEAR STRENGTH; TITANIA;

CERAMIC MATRIX COMPOSITES; CHEMISORPTION; DIELECTRIC PROPERTIES; ELECTRIC PROPERTIES; FIELD EMISSION MICROSCOPES; HEAT TREATMENT; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; LOADING; MECHANICAL PROPERTIES; NANOCOMPOSITES; POLYMER MATRIX COMPOSITES; SILICONES; THERMOGRAVIMETRIC ANALYSIS; TITANIUM DIOXIDE;

FILLERS;

EID: 84867458520     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.37777     Document Type: Article

References (39)

1. Girei, S. A.,;, Thomas, S. P.,;, Atieh, M. A.,;, Mezghani, K.,;, De, S. K.,;, Bandyopadhyay, S.,;, Al-Juhani, A., J. Thermoplastic Compos. Mater. 2011; Doi: 10.1177/0892705711406159.
2. Gunes, I. S.,;, Cao, F.,;, Jana, S. C., Polymer 2008, 49, 2223.
3. Dharaiya, D. P.,;, Jana, S. C., J. Polym. Sci. Part B: Polym. Phys. 2005, 43, 3638.
4. Thomas, P. S.,;, Girei, S. A.,;, Al-Juhani, A. A.,;, Mezghani, K.,;, De, S. K.,;, Atieh, M. A.,; Polym. Eng. Sci. 2011, 52, 525.
5. Rao, Y.,;, Ogitani, S.,;, Kohl, P.,;, Wong, C. P., Int. Symp. Adv. Packaging Mater. 2000, 32; Doi: 10.1109/ISAPM.2000.869239.
6. Rao, Y.,;, Wong, C. P.,;, Qu, J.,;, Marinis, T., Electron Components Technol. Conf. 2000, 615; Doi: 10.1109/ECTC.2000.853222.
7. Ramajo, L. A.,;, Reboredo, M. M.,;, Castro, M. S., J. Mater. Sci. 2007, 42, 3685.
8. Ramajo, L.,;, Castro, M. S.,;, Reboredo, M. M., J. Mater. Sci. 2010, 45, 106.
9. Matienzo, L. J.,;, Farquhar, D., J. Mater. Sci. 2008, 43, 2035.
10. Setter, N.,;, Waser, R., Acta Materialia 2000, 48, 151.
11. Chahal, P.,;, Tummala, R. R.,;, Allen, M. G.,;, Swaminathan, M., IEEE Trans. Components Packaging Manufact. Technol-Part B. 1998, 21 184.
12. Dias, C. J.,;, Igreja, R.,;, Marat-Mendes, R.,;, Inacio, P.,;, Marat-Mendes, J. N.,;, Das-Gupta, D. K., IEEE Trans. Dielectrics Electr. Insul. 2004, 11, 35.
13. Salaeh, S.,;, Muensit, N.,;, Bomlai, P.,;, Nakason, C., J. Mater. Sci. 2011, 46, 1723.
14. Murugendrappa, M. V.,;, Prasad, M. V. N. A., Mater. Res. Bull. 2006, 41, 1364.
15. Moa, T.-C.,;, Wang, H.-W.,;, Chen, S.-Y.,;, Yeh, Y.-C., Ceramics Int. 2008, 34, 1767.
16. Romig, A. D.,;, Dugger, M. T.,;, McWhorter, P., J. Acta Materialia 2003, 51, 5837.
17. Wegner, G., Acta Materialia 2000, 48, 253.
18. Sohi, N. J. S.,;, Rahaman, M.,;, Khastgir, D., Polym. Compos. 2011, 32, 1148.
19. Das, N. C.,;, Chaki, T. K.,;, Khastgir, D., Carbon 2002, 40, 807.
20. Sohi, N. J. S.,;, Bhadra, S.,;, Khastgir, D., Carbon 2011, 49, 1349.
21. Bhadra, S.,;, Kim, N. H.,;, Lee, J. H., J. Membr. Sci. 2010, 349, 304.
22. Kuilla, T.,;, Bhadra, S.,;, Yao, D.,;, Kim, N. H.,;, Bose, S.,;, Lee, J. H., Prog. Polym. Sci. 2010, 35, 1350.
23. Guin, A. K.,;, Nayak, S.,;, Rout, T. K.,;, Bandyopadhyay, N.,;, Sengupta, D. K., ISIJ Int. 2011, 51, 435.
24. Bai, Y.,;, Cheng, Z. Y.,;, Bharti, V.,;, Xu, H. S.,;, Zhang, Q. M., Appl. Phys. Lett. 2000, 76, 3804.
25. Guin, A. K.,;, Nayak, S. K.,;, Rout, T. K.,;, Bandyopadhyay, N.,;, Sengupta, D. K., J. Coatings Technol. Res. 2012, 9, 97.
26. Khastgir, D.,;, Adachi, K., Polymer 2000, 41, 6403.
27. Carpi, F.,;, Rossi, D. D., IEEE Trans. Dielectrics Electr. Insul. 2005, 12, 835.
28. Kovtyukhovaa, N.,;, Ollivierb, P. J.,;, Chizhikc, S.,;, Dubravinc, A.,;, Buzanevad, E.,;, Gorchinskiyd, A.,;, Marchenkoe, A.,;, Smirnova, N., Thin Solid Films 1999, 337, 166.
29. Khastgir, D.,;, Adachi, K., J. Polym. Sci. Part B: Polym. Phys. 1999, 37, 3065.
30. Cherney, E. A., IEEE Trans. Dielectrics Electr. Insul. 2005, 12, 1108.
31. Breckenridge, R. G.,;, Hoslfr, W. R., Phys. Rev. 1953, 91, 793.
32. Morimoto, T.,;, Iwaki, T., J. Chem. Soc. Faraday Trans. 1 1987, 83, 943.
33. Iwaki, T.,;, Morimoto, T., J. Chem. Soc. Faraday Trans. 1 1987, 83, 957.
34. Rahaman, M.,;, Chaki, T. K.,;, Khastgir, D., J. Mater. Sci. 2011, 46, 3989.
35. Dinh, L. N.,;, Burnham, A. K.,;, Schildbach, M. A.,;, Smith, R. A.,;, Maxwell, R. S.,;, Balazs, B.,;, W., M. II,. J. Vacuum Sci. Technol. A 2007, 25, 597.
36. Rahaman, M.,;, Chaki, T. K.,;, Khastgir, D., Polym. Compos. 2011, 32, 1790.
37. Sau, K. P.,;, Chaki, T. K.,;, Khastgir, D., J. Appl. Polym. Sci. 1999, 71, 887.
38. Das, N. C.,;, Chaki, T. K.,;, Khastgir, D.,;, Chakraborty, A., Kautschuk und Gummi Kunststoffe 2000, 55, 300.
39. Boonstra, B. B., Polymer 1979, 20, 691.