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Journal of Materials Science

Volumn 43, Issue 6, 2008, Pages 2035-2045

A model system for the optimization of lamination parameters of PTFE-based dielectrics and metal surfaces

(2) Matienzo, Luis J a Farquhar, Donald a

a Endicott Interconnect Technologies Inc (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST REDUCTION; ELECTRONICS PACKAGING; FLUORINE CONTAINING POLYMERS; LAMINATING; MICROELECTRONIC PROCESSING; OPTIMIZATION; PARAMETER ESTIMATION; PRINTED CIRCUIT BOARDS;

LAMINATION; MICROELECTRONIC PACKAGING; ORGANIC CHIPS;

DIELECTRIC MATERIALS;

EID: 39149123135 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-007-2426-8 Document Type: Article

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.