Electrocaloric temperature change constrained by the dielectric strength

Materials Chemistry and Physics

Volumn 136, Issue 2-3, 2012, Pages 277-280

  Valant, Matjaz ^a   Axelsson, Anna Karin ^b   Le Goupil, Florian ^b   Alford, Neil McN ^b  

^a UNIVERSITY OF NOVA GORICA   (Slovenia)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

Electrical characterization; Electronic materials; Microstructure

Indexed keywords

DIELECTRIC STRENGTHS; ELECTRICAL CHARACTERIZATION; ELECTRONIC MATERIALS; EXPERIMENTAL CHARACTERIZATION; KEY PARAMETERS; MICROSTRUCTURAL CHARACTERISTICS; REFRIGERATION TECHNOLOGY; RESEARCH AND DEVELOPMENT; TEMPERATURE CHANGES;

CHARACTERIZATION; DIELECTRIC MATERIALS; ELECTRIC FIELDS; ELECTROCHROMIC DEVICES; MICROSTRUCTURE; THICK FILMS;

STRENGTH OF MATERIALS;

EID: 84867402360     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2012.08.059     Document Type: Review

References (26)

1. Y.V. Sinyavski, G.E. Lugansky, and N.D. Pashov Cryogenics 32 1992 28 31
2. M.A. Hamad Appl. Phys. Lett. 100 2012 192908
3. M.A. Hamad, J. Comput. Electron., http://dx.doi.org/10.1007/s10825-012- 0414-y (on-line 30.7.12).
4. M. Valant Prog. Mater. Sci. 57 2012 980 1005
5. A.S. Mischenko, Q. Zhang, J.F. Scott, R.W. Whatmore, and N.D. Mathur Science 311 2006 1270 1271
6. B. Nesse, B. Chu, S.G. Lu, Y. Wang, E. Furman, and Q.M. Zhang Science 321 2008 821 823
7. J.F. Scott Annu. Rev. Mater. Res. 41 2011 229 240
8. R. Chukka, J.W. Cheah, Z. Chen, P. Yang, S. Shannigrahi, J. Wang, and L. Chen Appl. Phys. Lett. 98 2011 242902
9. B.A. Tuttle, and D.A. Payne Ferroelectrics 87 1981 603 606
10. A. Fuith, H. Kabelka, E. Birks, L. Shebanovs, and A. Sternberg Ferroelectrics 237 2000 153 159
11. R. Pirc, Z. Kutnjak, R. Blinc, and Q.M. Zhang Appl. Phys. Lett. 98 2011 021909
12. Z. Feng, D. Shi, R. Zeng, and S. Dou Thin Solid Films 519 2011 5433 5436
13. G. Akcay, S.P. Alpay, J.V. Mantese, and G.A. Rossetti Jr. Appl. Phys. Lett. 90 2007 252909
14. J.H. Qui, and Q. Jiang J. Appl. Phys. 103 2008 084105
15. H.B. Callen Phys. Rev. 76 1949 1394 1402
16. C.S. Praveen, A. Kokalj, and M. Valant Comp. Mater. Sci. 50 2011 2628 2635
17. V.K. Agarwal, and V.K. Srivastava Thin Solid Films 8 1971 377 381
18. F. Forlani, and N. Minnaja Phys. Status Solidi 4 1964 311 324
19. R. Gerson, and T.C. Marshall J. Appl. Phys. 30 1959 1650 1653
20. H. Yang, X.-L. Gong, N. Zhong, and Y.-L. Wang Jap. J. Appl. Phys. 43 2004 7579 7582
21. A.L. Young, G.E. Hilmas, S.C. Zhang, and R.W. Schwartz J. Mater. Sci. 42 2007 5613 5619
22. H.Y. Lee, K.H. Cho, and H.-D. Nam Ferroelectrics 334 2006 165 169
23. T. Tunkasiri, and G. Rujijanagul J. Mater. Sci. Lett. 15 1996 1767 1769
24. X. Xu, and G.E. Hilmas J. Am. Ceram. Soc. 89 2006 2496 2501
25. E.P. Gorzkowski, M.-J. Pan, B. Bender, and C.C.M. Wu J. Electroceram. 18 2007 269 276
26. J. Claude, Y. Lu, K. Li, and Q. Wang Chem. Mater. 20 2008 2078 2080