PCB drillability: A material science approach to resin development

Circuit World

Volumn 30, Issue 4, 2004, Pages 44-51

  Verghese, Nikhil ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

Epoxy resins; Laminates; Printed circuit boards

Indexed keywords

COPPER CLAD LAMINATE; DICYANDIAMIDE; MULTILAYER BOARDS; RESIN TOUGHNESS;

COPPER PLATING; DECOMPOSITION; DRILLING; EPOXY RESINS; GLASS TRANSITION; MULTILAYERS; PERMITTIVITY; PHENOLIC RESINS; PLASTIC LAMINATES; THERMODYNAMIC PROPERTIES;

PRINTED CIRCUIT BOARDS;

EID: 4344594014     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410539911     Document Type: Article

References (3)

1. American Society of Testing and Materials (1994), "Standard test method for Mode I interlaminar fracture toughness of unidirectional fiber-reinforced polymer-matrix composites", ASTM D 5528 American Society of Testing and Materials, West Conshohocken.
2. Mai, Y.W. and Atkins, A.G. (n.d), Elastic and Plastic Fracture-Metals, Polymers, Ceramics, Composites and Biological Materials.
3. Sperling, L.H. (1932), Polymeric Multicomponent Materials; An Introduction, reprint 1997, Wiley.