Silicon interposer with integrated antenna array for millimeter-wave short-range communications

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2012, Pages

  Dussopt, L ^a   Lamy, Y ^a   Joblot, S ^b   Lanteri, J ^a   Salti, H ^a   Bar, P ^b   Sibuet, H ^a   Reig, B ^a   Carpentier, J F ^b   Dehos, C ^a   Vincent, P ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

Antenna arrays; Integrated circuit packaging; Millimeter wave communication; Millimeter wave technology; Silicon; Wafer scale integration

Indexed keywords

ANTENNA DESIGN; ANTENNA ELEMENT; BEAM-STEERING; CAVITY BACKED ANTENNA; FABRICATION PROCESS; HIGH RESISTIVITY SILICON; INTEGRATED ANTENNAS; INTEGRATED CIRCUIT PACKAGING; MILLIMETER-WAVE COMMUNICATION; MILLIMETER-WAVE TECHNOLOGY; MULTI-GBPS; RADIATION GAIN; SHORT-RANGE COMMUNICATION; SILICON MICROMACHINING; THROUGH SILICON VIAS; WAFER TO WAFER BONDING; WAFER-SCALE INTEGRATION;

ANTENNA ARRAYS; MILLIMETER WAVES; SILICON; TELECOMMUNICATION SYSTEMS; WSI CIRCUITS;

SILICON WAFERS;

EID: 84866782526     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2012.6259424     Document Type: Conference Paper

References (5)

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