Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2011, Pages

  Enayati, Amin ^a,b,c   Brebels, Steven ^a   Vandenbosch, Guy A E ^b   Deraedt, Walter ^a   Räisänen, Antti V ^c  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c AALTO UNIVERSITY   (Finland)

Author keywords

60 GHz communication systems; antenna in package integration; cavity backed antenna; Multi chip module technology

Indexed keywords

3-D INTEGRATION; 60 GHZ COMMUNICATION SYSTEMS; ANTENNA ELEMENT; ANTENNA IN PACKAGES; CAVITY BACKED ANTENNA; FEEDING NETWORKS; MAIN BEAMS; MILLIMETER-WAVE SYSTEMS; MULTI-CHIP MODULE TECHNOLOGY; PEAK GAIN; RETURN LOSS; SILICON-BASED TECHNOLOGY; SIMULATION AND MEASUREMENT;

COMMUNICATION SYSTEMS; FREQUENCY BANDS;

ANTENNAS;

EID: 80052305119     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2011.5972815     Document Type: Conference Paper

References (5)

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