Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 315-321

  Moon, Seok Hwan ^a   Hwang, Gunn ^a   Ko, Sang Choon ^a   Kim, Youn Tae ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; HEAT LOSSES; HEAT TRANSFER; PACKAGING; PERSONAL DIGITAL ASSISTANTS; THERMAL LOAD; VACUUM APPLICATIONS;

ELECTRONIC PACKAGING; MICRO-HEAT PIPES (MHP);

HEAT PIPES;

EID: 0942288136     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00160-4     Document Type: Article

References (8)

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2. Cotter TP. Principles and prospects for micro heat pipes. In: Proceedings of the 5th International Heat Pipe Conference, 1984.
3. Gerner FM. Flow limitation in micro heat pipes. AFSOR Final Report No. F49620-88-6-0053, Wright-Patterson, AFB, Dayton, OH, 1989.
4. Xie H, Aghazadeh M, Toth J. The use of heat pipes in the cooling of portables with high power packages. Thermacore Co. Technical Note.
5. Hopkins R., Faghri A., Khrustalev D. Flat miniature heat pipe with micro capillary grooves. Trans. ASME. 121:1999;102-109.
6. Zaghdoudi MC, Sartre V, Lallemand M. Theoretical investigation of micro heat pipes performance. In: 10th International Heat Pipe Conference, Germany, 21-25 September, F-9, 1997.
7. Moon SH, et al. An experimental study on the performance limitation of a micro heat pipe with triangular cross-section. In: 11th International Heat Pipe Conference, Japan, 12-16 September, A1-4, 1999.
8. Moon SH, Hwang G, Kim YT, Seo JK, Kim SJ. Thermal analysis and testing of a miniature heat pipe with woven wire wick. ETRI J, in press.