Phase change effect of low melting point metal for an automatic cooling of USB flash memory

Frontiers in Energy

Volumn 6, Issue 3, 2012, Pages 207-209

  Ge, Haoshan ^a   Liu, Jing ^a,b  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b Tsinghua University ^*  (China)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84866447690     PISSN: 20951701     EISSN: 20951698     Source Type: Journal    
DOI: 10.1007/s11708-012-0204-z     Document Type: Article

References (12)

1. Chowdhury I, Prasher R, Lofgreen K, Chrysler G, Narasimhan S, Mahajan R, Koester D, Alley R, Venkatasubramanian R. On-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology, 2009, 4(4): 235-238.
2. Prada L, Garcia J D, Carretero J. Garcia F. Saving power in flash and disk hybrid storage system. In: 2009 IEEE International Symposium on Modeling, Analysis & Simulation of Computer and Telecommunication Systems, Arlington, Virginia, USA, 2009, 632-634.
3. Leo H L, Sinclair G B. Flash temperature distributions at the headdisk interface in hard disk drives. ASME Journal of Tribology, 1998, 120(3): 536-541.
4. Liu J, Zhou Y. Chip cooling device using low melting point metals or their alloys as the flow of refrigerant. China Patent, CN02131419. 5. 2004.
5. Ma K, Liu J. Liquid metal cooling in thermal management of computer chips. Frontiers of Energy and Power Engineering in China, 2007, 1(4): 384-402.
6. Li P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106.
7. Dai D, Zhou Y, Liu J. Liquid metal based thermoelectric generation system for waste heat recovery. Renewable Energy, 2011, 36(12): 3530-3536.
8. Deng Y, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788-791.
9. Li H, Liu J. Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20-42.
10. Lv Y, Liu J. Interpretation on thermal comfort mechanisms of human bodies by combining Hodgkin-Huxley neuron model and Pennes bioheat equation. Forschung im Ingenieurwesen, 2005, 69(2): 101-114.
11. Kandasamy R, Wang X Q, Mujumdar A S. Application of phase change materials in thermal management of electronics. Applied Thermal Engineering, 2007, 27(17, 18): 2822-2832.
12. Shen W J, Tan F L. Thermal management of mobile devices. Thermal Science, 2010, 14(1): 115-124.