Conformal coatings for tin whisker risk management

IPC APEX EXPO Technical Conference 2010

Volumn 2, Issue , 2010, Pages 890-920

  Fox, William ^a   Woody, Linda ^a  

^a Lochkeed Martin Missile and Fire Control   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BASE METALS; CONFORMAL COATINGS; PARYLENES; POLYURETHANE COATINGS; PROCESSING TECHNIQUE; TIN WHISKER; TRIAL PERIOD;

ALLOYS; COATINGS; COPPER; CRYSTAL WHISKERS; EXHIBITIONS; MATERIALS PROPERTIES; POLYURETHANES; RISK MANAGEMENT; SCANNING ELECTRON MICROSCOPY;

TIN;

EID: 84866034353     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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2. A. Selucker, M. Johnson, "Microstructural Characterization of Electrodeposited Tin Layer in Relation to Whisker Growth", Capacitor and Resistor Technology Symposium Proceedings, October 1990, pp 19-22.
3. th International SAMPE Electronics Conference Proceedings, June 12-14, 1990, pp 569-575.
4. B.Z. Lee, D.N. Lee. "Spontaneous Growth Mechanism of Tin Whiskers", Acta Metallurgica, Vol. 46, No. 10, 1998, pp 917-922.
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7. nd IAASS Conference, May 14-16, 2007.
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9. J.S. Kadesch, J.A. Brusse, "The Continuing Dangers of Tin Whiskers and Attempts to Control Them With Conformal Coat", NASA's EEE Links Newsletter, July 2001.
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11. th International Conference on Pb-Free Electronic Components and Assemblies, April 18-20, 2005.
12. T. Woodrow, E. Ledbury, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part 2", Proceedings of SMTA International Conference, September 24-28, 2006.
13. S. Han, C. Jang, B. Han, M. Osterman, "Examination of Properties and Failure Mitigation Offered by Conformal Coats", Center for Advanced Life Cycle Engineering Electronic Products and Systems Consortium Technical Review, October 13-14, 2009.
14. C. Coombs, ed. Printed Circuits Handbook 6th Edition. New York: McGraw-Hill, 2008.
15. http://nepp.nasa.gov/whisker/