Investigation of polyimide/carbon nanotube nanocomposites for high temperature electronic packaging applications

Proceedings - 2009 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2009

Volumn , Issue , 2009, Pages 110-115

  Tang, Q Y ^a   Chan, Y C ^a   Wong, N B ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Carbon nanotube; Electrical properties; Electronic packaging; Polyimide nanocomposites; Reliability; Thermal mechanical properties

Indexed keywords

DYNAMIC MECHANICAL PROPERTY; ELECTRONIC PACKAGING; HIGH-GLASS TRANSITION TEMPERATURES; HIGH-TEMPERATURE ELECTRONICS; IN-SITU POLYMERIZATION; MEASUREMENT AND CONTROL; RESISTANCE PROPERTIES; THERMAL MECHANICAL PROPERTIES;

AIRCRAFT ENGINES; CARBON NANOTUBES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MICROELECTRONICS; MICROSTRUCTURE; NANOCOMPOSITES; POLYIMIDES; POWER ELECTRONICS; RELIABILITY; SPACE APPLICATIONS; SURFACE ACTIVE AGENTS; WELL DRILLING;

HIGH TEMPERATURE APPLICATIONS;

EID: 84865626625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, "Thermal Transport Measurements of Individual Multiwalled Nanotubes," Physical Review Letters, vol. 87, pp. 215502, 2001.
2. M. Y. Tsai, C. Y. Yu, C. H. Yang, N. H. Tai, T. P. Perng, C. M. Tu, Z. H. Khan, Y. C. Liao, and C. C. Chi, "Electrical transport properties of individual disordered multiwalled carbon nanotubes," Applied Physics Letters, vol. 89, pp. 192115, 2006.
3. M. F. Yu, B. S. Files, S. Arepalli, and R. S. Ruoff, "Tensile loading of ropes of single wall carbon nanotubes and their mechanical properties," Physical Review Letters, vol. 84, pp. 5552-5555, 2000.
4. X. Lin and F. Lin, "The improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube," High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on, pp. 382-384.2004.
5. M. B. Saeed, "Adhesive and mechanical properties of Carbon nanotube filled thermoplastic polyimide films for microelectronics packaging," Emerging Technologies, 2007. ICET 2007. International Conference on, pp. 300-305. 2007.
6. K. Umishita, T. Okubo, N. Takuya, and O. Hashimoto, "Absorption and Shielding Effect of Electromagnetic Wave at GHz Frequency by Multi-walled Carbon Nanotube/Polymer Composites," Wireless Technology, 2006. The 9th European Conference on, pp. 291-294.2006.
7. M. F. Islam, E. Rojas, D. M. Bergey, A. T. Johnson, and A. G. Yodh, "High weight fraction surfactant solubilization of single-wall carbon nanotubes in water," Nano Letters, vol. 3, pp. 269-273, 2003.
8. T. J. Simmons, D. Hashim, R. Vajtai, and P. M. Ajayan, "Large area-aligned arrays from direct deposition of single-wall carbon nanotube inks," Journal of the American Chemical Society, vol. 129, pp. 10088, 2007.
9. W. J. Chou, C. C. Wang, and C. Y. Chen, "Characteristics of polyimide-based nanocomposites containing plasma-modified multi-walled carbon nanotubes," Composites Science and Technology, vol. 68, pp. 2208-2213, 2008.
10. T. C. Mo, H. W. Wang, S. Y. Chen, and Y. C. Yeh, "Synthesis and characterization of polyimide/multi-walled carbon nanotube nanocomposites," Polymer Composites, vol. 29, pp. 451-457, 2008.
11. S. M. Yuen, C. C. M. Ma, Y. Y. Lin, and H. C. Kuan, "Preparation, morphology and properties of acid and amine modified multiwalled carbon nanotube/polylmide composite," Composites Science and Technology, vol. 67, pp. 2564-2573, 2007.
12. Z. Ounaies, C. Park, K. E. Wise, E. J. Siochi, and J. S. Harrison, "Electrical properties of single wall carbon nanotube reinforced polyimide composites," Composites Science and Technology, vol. 63, pp. 1637-1646, 2003.