Understanding wettability changes from practical plasma functionalization of carbon nanotubes

Nanoscience and Nanotechnology Letters

Volumn 4, Issue 3, 2012, Pages 344-347

  Kafi, Abdullah A ^a   Chen, Zhiqiang ^a   Dai, Xiujuan J ^a   Fox, Bronwyn L ^a   Lamb, Peter R ^a   Wang, Xungai ^a  

^a DEAKIN UNIVERSITY   (Australia)

Author keywords

Carbon Nanotube; Plasma Functionalization; Primary Amine; Wettability

Indexed keywords

CONTINUOUS WAVE; HIGH DENSITY; INERT MATERIALS; INTERFACIAL BONDING; MODEL CALCULATIONS; NANO-STRUCTURED; NON-POLAR; PLASMA FUNCTIONALIZATION; PLASMA METHODS; PLASMA TREATMENT; PRIMARY AMINE GROUPS; PRIMARY AMINES; PROBE LIQUID; PULSED PLASMA; SURFACE FUNCTIONAL GROUPS;

BIOLOGICAL MATERIALS; CARBON NANOTUBES; CONTACT ANGLE; FUNCTIONAL GROUPS; MULTIWALLED CARBON NANOTUBES (MWCN); PLASMA APPLICATIONS; SURFACE CHEMISTRY; THIN FILMS; WETTING;

PLASMAS;

EID: 84864857878     PISSN: 19414900     EISSN: 19414919     Source Type: Journal    
DOI: 10.1166/nnl.2012.1315     Document Type: Article

References (16)

1. N. Karousis, N. Tagmatarchis, and D. Tasis, Chem. Rev. 110, 5366 (2010).
2. F. Lu, L. Gu, M. J. Meziani, X. Wang, P. G. Luo, L. M. Veca, L. Cao, and Y.-P. Sun, Adv. Mater. 21, 139 (2009).
3. P. Garg, B. P. Singh, G. Kumar, T. Gupta, I. Pandey, R. K. Seth, R. P. Tandon, and R. B. Mathur, J. Polym. Res. 18, 1397 (2011).
4. J. Zhu, J. Kim, H. Peng, J. L. Margrave, V. N. Khabashesku, and E. V. Barrera, Nano Lett. 3, 1107 (2003).
5. H. Y. Ma, L. F. Tong, Z. B. Xu, and Z. P. Fang, Adv. Funct. Mater. 18, 414 (2008).
6. L. Li, X. J. Dai, H. S. Xu, J. H. Zhao, P. Yang, G. Maurdev, J. du Plessis, P. R. Lamb, B. L. Fox, and W. P. Michalski, Plasma Process. Polym. 6, 615 (2009).
7. Z. Q. Chen, X. J. Dai, and X. G. Wang, Three plasma modes for surface functionalization of multiwall carbon nanotubes in nitrogen plus hydrogen gas mixtures, Proceedings of International Conference on Nanoscience and Technology, Beijing, China, September (2011), pp. 7-9.
8. X. J. Dai, J. du Plessis, I. L. Kyratzis, G. Maurdev, M. G. Huson, and C. Coombs, Plasma Process. Polym. 6, 490 (2009).
9. P. C. Ma, N. A. Siddiqui, G. Marom, and J. K. Kim, Compos. A Appl. Sci. Manuf. 41, 1345 (2010).
10. F. Etzler, Contact Angle, Wettability and Adhesion, edited by K. L. Mittal, VSP, Utrecht, The Netherlands (2003) Vol. 3, pp. 1-46.
11. A. A. Kafi, K. Magniez, C. Cinquemani, and B. L. Fox, J. Adhesion Sci. Technol. 26, 151 (2011).
12. D. J. Gardner, G. S. Oporto, R. Mills, and M. A. S. A. Samir, J. Adhesion Sci. Technol. 22, 545 (2008).
13. W. T. Tze and D. J. Gardner, J. Adhesion Sci. Technol. 15, 223 (2001).
14. X. J. Dai, Y. Chen, Z. Chen, P. R. Lamb, L. H. Li, J. du Plessis, D. G. McCulloch, and X. Wang, Nanotechnology 22, 245 (2011).
15. F. Chen and W. V. Chang, Langmuir 7, 2401 (1991).
16. A. Felten, C. Bittencourt, J. J. Pireaux, G. Van Lier, and J. C. Charlier, J. Appl. Phys. 98, 1 (2005).