-
1
-
-
33747302313
-
A chip-scale packaging technology for 60-GHz wireless chipsets
-
Aug.
-
U. R. Pfeiffer, J. Grzyb, L. Duixian, B. Gaucher, T. Beukema, B. A. Floyd, and S. K. Reynolds, "A chip-scale packaging technology for 60-GHz wireless chipsets," IEEE Trans. Microw. Theory Tech., vol. 54, pp. 3387-97, Aug. 2006.
-
(2006)
IEEE Trans. Microw. Theory Tech.
, vol.54
, pp. 3387-3397
-
-
Pfeiffer, U.R.1
Grzyb, J.2
Duixian, L.3
Gaucher, B.4
Beukema, T.5
Floyd, B.A.6
Reynolds, S.K.7
-
2
-
-
68649106231
-
A zero-IF 60 GHz 65 nm CMOS transceiver with direct BPSK modulation demonstrating up to 6 Gb/s data rates over a 2 m wireless link
-
Aug.
-
A. Tomkins, R. A. Aroca, T. Yamamoto, S. T. Nicolson, Y. Doi, and S. P. Voinigescu, "A zero-IF 60 GHz 65 nm CMOS transceiver with direct BPSK modulation demonstrating up to 6 Gb/s data rates over a 2 m wireless link," IEEE J. Solid-State Circuits, vol. 44, pp. 2085-99, Aug. 2009.
-
(2009)
IEEE J. Solid-State Circuits
, vol.44
, pp. 2085-2099
-
-
Tomkins, A.1
Aroca, R.A.2
Yamamoto, T.3
Nicolson, S.T.4
Doi, Y.5
Voinigescu, S.P.6
-
3
-
-
48849110387
-
Single-chip W-band SiGe HBT transceivers and receivers for Doppler radar and millimeter-wave imaging
-
Oct.
-
S. T. Nicolson, P. Chevalier, B. Sautreuil, and S. P. Voinigescu, "Single-chip W-band SiGe HBT transceivers and receivers for Doppler radar and millimeter-wave imaging," IEEE J. Solid-State Circuits, vol. 43, pp. 2206-17, Oct. 2008.
-
(2008)
IEEE J. Solid-State Circuits
, vol.43
, pp. 2206-2217
-
-
Nicolson, S.T.1
Chevalier, P.2
Sautreuil, B.3
Voinigescu, S.P.4
-
4
-
-
77949829315
-
Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios
-
Oct.
-
Y. P. Zhang, M. Sun, K. M. Chua, L. L. Wai, and L. Duixian, "Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios," IEEE Trans. Antennas and Propag., vol. 57, pp. 2842-52, Oct. 2009.
-
(2009)
IEEE Trans. Antennas and Propag.
, vol.57
, pp. 2842-2852
-
-
Zhang, Y.P.1
Sun, M.2
Chua, K.M.3
Wai, L.L.4
Duixian, L.5
-
5
-
-
79851480245
-
A low-cost high-gain antenna array and its integration with active circuits
-
S. Hu, Y. Z. Xiong, L. Wang, D. Hou , and T. G. Lim, "A low-cost high-gain antenna array and its integration with active circuits," in IEEE Electrical Design of Advanced Packag. Systems Symp., Dec. 2010.
-
IEEE Electrical Design of Advanced Packag. Systems Symp., Dec. 2010
-
-
Hu, S.1
Xiong, Y.Z.2
Wang, L.3
Hou, D.4
Lim, T.G.5
-
6
-
-
79851479836
-
Performance analyse on millimetre-wave bonding-wire interconnection
-
J. Li, Y. Z. Xiong, S. Hu, W. L. Goh, D. Hou, and W. Wu, "Performance analyse on millimetre-wave bonding-wire interconnection," in IEEE Electrical Design of Advanced Package. Systems Symp., Dec. 2010.
-
IEEE Electrical Design of Advanced Package. Systems Symp., Dec. 2010
-
-
Li, J.1
Xiong, Y.Z.2
Hu, S.3
Goh, W.L.4
Hou, D.5
Wu, W.6
-
7
-
-
79960403414
-
A millimeterwave wideband high-gain antenna and its 3D system-in-package solution in a TSV-compatible technology
-
S. Hu, Y. Z. Xiong, L. Wang, R. Li, and T. G. Lim, "A millimeterwave wideband high-gain antenna and its 3D system-in-package solution in a TSV-compatible technology," in IEEE 61st Electron. Compon. Technol. Conf., May, 2011, pp. 869-72.
-
IEEE 61st Electron. Compon. Technol. Conf., May, 2011
, pp. 869-872
-
-
Hu, S.1
Xiong, Y.Z.2
Wang, L.3
Li, R.4
Lim, T.G.5
-
8
-
-
79960044080
-
Microfabrication of a planar helix with straight-edge connections slow-wave structure
-
C. Chua, J. Tsai, M. Tang, S. Aditya, and Z. Shen, "Microfabrication of a planar helix with straight-edge connections slow-wave structure," in Intern. Conf. Materials Advanced Tech., Jun. 2011, pp. 17-20.
-
Intern. Conf. Materials Advanced Tech., Jun. 2011
, pp. 17-20
-
-
Chua, C.1
Tsai, J.2
Tang, M.3
Aditya, S.4
Shen, Z.5
-
9
-
-
79960409838
-
The design of broadband 3D Si-based directional couplers for millimeter-wave/THz applications
-
J. Li, Y.-Z. Xiong, D. Hou, T.-G. Lim, T. Min, W. L. Goh, and W. Wu, "The design of broadband 3D Si-based directional couplers for millimeter-wave/THz applications," in IEEE 61st Electron. Compon. Technol. Conf., May, 2011, pp. 1064-1069.
-
IEEE 61st Electron. Compon. Technol. Conf., May, 2011
, pp. 1064-1069
-
-
Li, J.1
Xiong, Y.-Z.2
Hou, D.3
Lim, T.-G.4
Min, T.5
Goh, W.L.6
Wu, W.7
-
10
-
-
0037616272
-
Performance Characteristics of the Dual Exponentially Tapered Slot Antenna (DETSA) for Wireless Communications Applications
-
March
-
M. C. Greenberg et al., "Performance Characteristics of the Dual Exponentially Tapered Slot Antenna (DETSA) for Wireless Communications Applications," IEEE Trans. Vehicular Tech., vol. 52, no. 2, pp. 305-312, March, 2003.
-
(2003)
IEEE Trans. Vehicular Tech.
, vol.52
, Issue.2
, pp. 305-312
-
-
Greenberg, M.C.1
-
11
-
-
0031623846
-
CPS structure potentialities for MMICs: A CPS/CPW transition and a bias network
-
D. Prieto, J. C. Cayrout, J. L. Cazaux, T. Parra, and J. Graffeuil, "CPS structure potentialities for MMICs: A CPS/CPW transition and a bias network," in Proc. IEEE MTT-S Int. Symp., 1998, vol. 1, pp. 111-114.
-
(1998)
Proc. IEEE MTT-S Int. Symp.
, vol.1
, pp. 111-114
-
-
Prieto, D.1
Cayrout, J.C.2
Cazaux, J.L.3
Parra, T.4
Graffeuil, J.5
-
12
-
-
28644438362
-
Study of a printed circular disc monopole antenna for UWB systems
-
Nov.
-
J. Liang, C. C. Chiau, X. Chen, and C. G. Parini, "Study of a printed circular disc monopole antenna for UWB systems," IEEE Trans. Antennas Propag., vol. 53, no. 11, pp. 3500-3504, Nov. 2005.
-
(2005)
IEEE Trans. Antennas Propag.
, vol.53
, Issue.11
, pp. 3500-3504
-
-
Liang, J.1
Chiau, C.C.2
Chen, X.3
Parini, C.G.4
-
13
-
-
23944505322
-
On-chip antennas for 60-GHz radios in silicon technology
-
July
-
Y. P. Zhang, M. Sun, and L. H. Guo, "On-chip antennas for 60-GHz radios in silicon technology," IEEE Trans. Electron Devices, vol. 52, no. 7, pp. 1664-1668, July, 2005.
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.7
, pp. 1664-1668
-
-
Zhang, Y.P.1
Sun, M.2
Guo, L.H.3
-
14
-
-
44849108866
-
A 60-GHz millimeter-wave CPW-fed Yagi antenna fabricated by using 0.18- μm CMOS technology
-
June
-
H. Shun-Sheng, W. Kuo-Chih, H. Cheng-Ying, and R.-C. Huey, "A 60-GHz millimeter-wave CPW-fed Yagi antenna fabricated by using 0.18- μm CMOS technology," IEEE Electron Device Lett., vol. 29, no. 6, pp. 625-627, June, 2008.
-
(2008)
IEEE Electron Device Lett.
, vol.29
, Issue.6
, pp. 625-627
-
-
Shun-Sheng, H.1
Kuo-Chih, W.2
Cheng-Ying, H.3
Huey, R.-C.4
-
15
-
-
57149144929
-
Dielectric resonator antenna on silicon substrate for system on-chip applications
-
Nov.
-
P. V. Bijumon, Y. Antar, A. P. Freundorfer, and M. Sayer, "Dielectric resonator antenna on silicon substrate for system on-chip applications," IEEE Trans. Antennas and Propag., vol. 56, no. 11, pp. 3404-3410, Nov., 2008.
-
(2008)
IEEE Trans. Antennas and Propag.
, vol.56
, Issue.11
, pp. 3404-3410
-
-
Bijumon, P.V.1
Antar, Y.2
Freundorfer, A.P.3
Sayer, M.4
-
16
-
-
77957800881
-
High-efficiency on-chip dielectric resonator antenna for mm-wave transceivers
-
M. R. Nezhad-Ahmadi, M. Fakharzadeh, B. Biglarbegian, and S. Safavi-Naeini, "High-efficiency on-chip dielectric resonator antenna for mm-wave transceivers," IEEE Trans. Antennas and Propag., vol. 58, no. 10, pp. 3388-3392, 2010.
-
(2010)
IEEE Trans. Antennas and Propag.
, vol.58
, Issue.10
, pp. 3388-3392
-
-
Nezhad-Ahmadi, M.R.1
Fakharzadeh, M.2
Biglarbegian, B.3
Safavi-Naeini, S.4
-
18
-
-
79959687396
-
MMW Antenna in IPD Process for 60-GHz WPAN Applications
-
June
-
H. Fu-Jhuan, L. Chien-Ming, K. Chueh-Yu, and L. Ching-Hsing, "MMW Antenna in IPD Process for 60-GHz WPAN Applications," IEEE Antennas and Wireless Propag. Lett., vol. 10, pp. 565-8, June, 2011.
-
(2011)
IEEE Antennas and Wireless Propag. Lett.
, vol.10
, pp. 565-568
-
-
Fu-Jhuan, H.1
Chien-Ming, L.2
Chueh-Yu, K.3
Ching-Hsing, L.4
-
19
-
-
67650355031
-
Development of a 60-GHz bandpass filter and a dipole antenna using wafer transfer technology
-
July
-
Y. X. Guo, J. Wang ,B. Luo , and E. Liao, "Development of a 60-GHz bandpass filter and a dipole antenna using wafer transfer technology," IEEE Electron Device Letters, vol. 30, pp. 784-6, July, 2009.
-
(2009)
IEEE Electron Device Letters
, vol.30
, pp. 784-786
-
-
Guo, Y.X.1
Wang, J.2
Luo, B.3
Liao, E.4
|