Evaluation of manufacturing handling characteristics of hydrogen peroxide-based tungsten CMP slurry

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 164-171

  Bare, J P ^a   Johl, B ^a  

^a FSI International Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ENGINES; HYDROGEN PEROXIDE; INDUSTRIAL ELECTRONICS; OXIDATION; PARTICLE SIZE; PARTICLE SIZE ANALYSIS; PEROXIDES; PIPING SYSTEMS; POLISHING; SCALES (WEIGHING INSTRUMENTS); SEMICONDUCTOR DEVICE MANUFACTURE; TESTING; TITRATION;

ACCELERATED AGING TEST; BULK DELIVERY SYSTEMS; DISTRIBUTION SYSTEMS; HANDLING CHARACTERISTICS; HYDROGEN PEROXIDE CONCENTRATION; HYDROGEN PEROXIDE DECOMPOSITION; MEASURED PARAMETERS; SEMICONDUCTOR MANUFACTURING;

SLURRIES;

EID: 84863570269     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731072     Document Type: Conference Paper

References (5)

1. Philipossian, et al., "An Overview of Current Issues and Future Trends in CMP Consumables, " Proceedings of the First CMP-MIC Conference, February 1996, pp. 13-19.
2. Bare JP, Lemke TA, "Monitoring slurry stability to reduce process variability, " MICRO, pp. 53-63, September 1997.
3. Nagahara, et al., "The Effect of Slurry Particle Size on Defect Levels for a BPSG CMP Process, " Proceedings of 1996 VMIC Conference, June 1996, p. 443.
4. Capitanio, et al, "Defect Reduction During Chemical Mechanical Planarization by Incorporation of Slurry Filtration, " Proceedings of SEMICON/West Contamination in Liquid Chemical Distribution Systems Workshop, July 1998.
5. Bare JP, Johl B, Lemke TA, "Comparison of Vacuum-Pressure vs. Pump Dispense Engines for CMP Slurry Distribution, " Proceedings of SEMICON/West Contamination in Liquid Chemical Distribution Systems Workshop, July 1998.