Solidification of Au-Cu-Si alloys investigated by a combinatorial approach

Journal of Applied Physics

Volumn 111, Issue 11, 2012, Pages

  Ding, Shiyan ^a   Gregoire, John ^b   Vlassak, Joost J ^b   Schroers, Jan ^a  

^a Yale University   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC PERCENTAGE; BULK METALLIC GLASS; CO-SPUTTERING DEPOSITION; COMBINATORIAL APPROACH; COMPOSITION DEPENDENCE; ELEMENTAL TARGETS; EUTECTIC COMPOSITION; GLASS FORMING ABILITY; GLASS FORMING COMPOSITION; HIGH-THROUGHPUT; MELTING AND SOLIDIFICATION; NUCLEATION TEMPERATURE; OPTICAL CHARACTERIZATION; PRIMARY PHASE;

COPPER; COPPER ALLOYS; GOLD; METALLIC GLASS; NUCLEATION; SILICON; SILICON ALLOYS;

SOLIDIFICATION;

EID: 84863330985     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4722996     Document Type: Conference Paper

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