Analysis of cooling a microprocessor using embedded thermoelectric coolers

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Volumn , Issue , 2011, Pages 495-498

  Park, Won Ho ^a   Yang, C K Ken ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING POWER; ELECTRONIC COMPONENT; IMPROVED RELIABILITY; LEAKAGE POWER; OPTIMAL OPERATING POINT; POWER SAVINGS; THERMOELECTRIC COOLER; THERMOELECTRIC COOLING; THERMOELECTRIC ELEMENT; TOTAL POWER; TOTAL POWER DISSIPATION;

ELECTRIC NETWORK ANALYSIS; MICROPROCESSOR CHIPS; MICROSYSTEMS; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY;

THERMOELECTRIC EQUIPMENT;

EID: 84863168388     PISSN: 21505934     EISSN: 21505942     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2011.6117156     Document Type: Conference Paper

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