Analytical solution for the bond strength of externally bonded reinforcement

Composite Structures

Volumn 94, Issue 11, 2012, Pages 3232-3239

  Wu, Yu Fei ^a   Xu, Xin Sheng ^a,b   Sun, Jia Bin ^a,b   Jiang, Cheng ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Adhesion; Analytical modeling; Debonding; Interface

Indexed keywords

ANALYTICAL METHOD; ANALYTICAL MODELING; BOND MODELS; CLOSED FORM SOLUTIONS; EXTERNALLY BONDED; INTERFACIAL BEHAVIORS; INTERFACIAL BOND STRENGTH; MATERIAL PROPERTY; PULL-OFF TESTS; SEMIEMPIRICAL MODELS; SNAP-BACK PHENOMENA;

ADHESION; DEBONDING; INTERFACES (MATERIALS); REINFORCEMENT;

BOND STRENGTH (MATERIALS);

EID: 84863086703     PISSN: 02638223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compstruct.2012.04.026     Document Type: Article

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