Facile route toward mechanically stable superhydrophobic copper using oxidation-reduction induced morphology changes

Journal of Physical Chemistry C

Volumn 116, Issue 4, 2012, Pages 2781-2790

  Lee, Seung Mo ^a   Kim, Kwang Seop ^a   Pippel, Eckhard ^b   Kim, Sangmin ^a   Kim, Jae Hyun ^a   Lee, Hak Joo ^a  

^a Korea Institute of Machine and Materials   (South Korea)

^b MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION BEHAVIORS; ANTI-CORROSION; ANTIBIOFOULING; COPPER STRUCTURES; COPPER SUBSTRATES; COPPER-BASED; HYDROPHOBIC AGENTS; MECHANICALLY STABLE; MINIATURE STRUCTURES; MORPHOLOGICAL CHANGES; MORPHOLOGY CHANGES; OXIDATION-REDUCTION REACTION; PINNING EFFECTS; SCALABLE METHODS; SLIDING ANGLE; SUBSEQUENT REDUCTION; SUPERHYDROPHOBIC; THERMAL OXIDATION;

ADHESION; CHEMICAL STABILITY; CONTACT ANGLE; HYDROPHOBICITY; MECHANICAL STABILITY; NANOWIRES; OXIDATION; REDOX REACTIONS; REDUCTION; SCALABILITY;

COPPER;

EID: 84863012381     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp2109626     Document Type: Article

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