Statistical analysis of electrical breakdown behavior of polyimide following degrading processes

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 18, Issue 6, 2011, Pages 1955-1962

  Li, L ^a   Bowler, N ^a   Hondred, P R ^a   Kessler, M R ^a  

^a Iowa State University   (United States)

Author keywords

dielectric strength; electrical breakdown; immersion in water; polyimide; thermal exposure; Weibulldistribution

Indexed keywords

CHEMICAL DEGRADATION; DIELECTRIC STRENGTHS; DISTILLED WATER; DISTRIBUTION ANALYSIS; ELECTRICAL BREAKDOWN; INSULATION MATERIALS; INSULATION PROPERTY; LEAST SQUARES REGRESSION; MECHANICAL AND THERMAL PROPERTIES; MOISTURE ABSORPTION; PI FILM; ROOM TEMPERATURE; SCALE PARAMETER; SHAPE PARAMETERS; THERMAL EXPOSURE; WEAK POINTS; WEIBULL; WEIBULL CUMULATIVE DISTRIBUTION FUNCTIONS;

DEGRADATION; DETERIORATION; DISTRIBUTION FUNCTIONS; ELECTRIC BREAKDOWN OF LIQUIDS; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; POLYIMIDES; THERMAL INSULATION; THERMODYNAMIC PROPERTIES; WATER ABSORPTION;

WEIBULL DISTRIBUTION;

EID: 84862951180     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2011.6118633     Document Type: Article

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