60-GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65-nm flip-chip CMOS process

IEEE Transactions on Microwave Theory and Techniques

Volumn 60, Issue 3 PART 2, 2012, Pages 743-756

  Kuo, Jing Lin ^a   Lu, Yi Fong ^a   Huang, Ting Yi ^a   Chang, Yi Long ^a   Hsieh, Yi Keng ^a   Peng, Pen Jui ^a   Chang, I Chih ^a   Tsai, Tzung Chuen ^a   Kao, Kun Yao ^a   Hsiung, Wei Yuan ^b   Wang, James ^b   Hsu, Yungping Alvin ^b   Lin, Kun You ^a   Lu, Hsin Chia ^a   Lin, Yi Cheng ^a   Lu, Liang Hung ^a   Huang, Tian Wei ^a   Wu, Ruey Beei ^a   Wang, Huei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b MEDIATEK INC   (Taiwan)

Author keywords

60 GHz; Beamforming; CMOS; flip chip; phase compensated techniques; phased array; system in package (SiP); variable gain amplifier (VGA); wireless communication

Indexed keywords

60 GHZ; CMOS; FLIP CHIP; PHASE-COMPENSATED TECHNIQUES; SYSTEM-IN-PACKAGE; VARIABLE GAIN AMPLIFIERS; WIRELESS COMMUNICATION;

BEAMFORMING; CMOS INTEGRATED CIRCUITS; DIFFERENTIAL AMPLIFIERS; DIGITAL CONTROL SYSTEMS; ELECTROSTATIC DEVICES; FLIP CHIP DEVICES; LOW NOISE AMPLIFIERS; POWER AMPLIFIERS; RECEIVING ANTENNAS; VOLTAGE REGULATORS; WIRELESS TELECOMMUNICATION SYSTEMS;

ANTENNA PHASED ARRAYS;

EID: 84862808210     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2011.2176508     Document Type: Article

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