Printed Se-doped MA n-Type Bi 2Te 3 thick-film thermoelectric generators

Journal of Electronic Materials

Volumn 41, Issue 6, 2012, Pages 1481-1486

  Madan, Deepa ^a   Chen, Alic ^a   Wright, Paul K ^a   Evans, James W ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Lawrence Berkeley National Laboratory   (United States)

Author keywords

dispenser printing; energy harvesting; mechanical alloy; polymer composites; Thermoelectric

Indexed keywords

AS-MILLED POWDERS; DEPOSITION TECHNIQUE; DEVICE FABRICATIONS; DIMENSIONLESS FIGURE OF MERIT; EPOXY COMPOSITE; FABRICATION TECHNIQUE; GOLD CONTACTS; HIGH ASPECT RATIO; HIGH-DENSITY ARRAYS; LOW-TEMPERATURE APPLICATIONS; MATERIALS PROCESSING; MECHANICAL ALLOYS; MICROSCALE ENERGY; MOLAR RATIO; PHASE FORMATIONS; POLYIMIDE SUBSTRATE; POLYMER COMPOSITE; POWER OUT PUT; PROTOTYPE DEVICES; ROOM TEMPERATURE; TEMPERATURE DIFFERENCES; THERMOELECTRIC; THERMOELECTRIC GENERATORS; THERMOELECTRIC PROPERTIES;

ASPECT RATIO; DISPENSERS; ENERGY CONVERSION; ENERGY HARVESTING; MECHANICAL ALLOYING; METALLURGY; POLYIMIDES; POWDERS; SCANNING ELECTRON MICROSCOPY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; X RAY DIFFRACTION; X RAY POWDER DIFFRACTION;

BISMUTH;

EID: 84862200488     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1885-5     Document Type: Article

References (20)

1. GJ Snyder ES Toberer 2008 Nat. Mater. 7 105 10.1038/nmat2090 1:CAS:528:DC%2BD1cXhtVGltbk%3D
2. D.M. Rowe, Thermoelectrics Handbook: Micro to Nano (Boca Raton: Taylor and Francis, 2005).
3. W Glatz E Schwyter L Durrer C Hierold 2009 J. Micromech. Microeng. 18 763 1:CAS:528:DC%2BD1MXotFOgu70%3D
4. J Weber K Potje-Komloth F Haase P Detemple F Volklein T Doll 2006 Sensors Actuators A 132 325 10.1016/j.sna.2006.04.054
5. K. Gilleo, Polymer Thick Film (New York: Thomson, 2006).
6. K. Miyazaki, T. Lida, and H. Tsukamoto, Proceedings of 22nd International Conference on Thermoelectrics (France, 17-21 August, 2003), p. 641.
7. C.C. Ho, J.W. Evans, and P.K. Wright, Proceedings of Ninth Power MEMS Workshop (2009), p. 141.
8. CC Ho D Steingart JW Evans PK Wright 2008 ECS Trans. 16 1 35 10.1149/1.2985625 1:CAS:528:DC%2BD1MXhtlOjtg%3D%3D
9. ES Leland PK Wright RM White 2009 J. Micromech. Microeng. 19 094018 10.1088/0960-1317/19/9/094018
10. HJ Goldsmid RW Douglas 1954 Br. J. Appl. Phys. 5 386 10.1088/0508-3443/5/ 11/303
11. A Chen M Koplow D Madan PK Wright JW Evans 2009 Proc. ASME Conf. 12 343
12. A Chen D Madan PK Wright JW Evans 2011 J. Micromech. Microeng. 21 10 104006 10.1088/0960-1317/21/10/104006
13. LD Zhao BP Zhang JF Li M Zhou WS Liu 2007 Phys. B 400 11 15 10.1016/j.physb.2007.06.009 1:CAS:528:DC%2BD2sXhtFKhs7zL
14. D Madan A Chen PK Wright JW Evans 2011 J. Appl. Phys. 109 034904 10.1063/1.3544501
15. W Glatz S Muntwyler C Hierold 2006 Sensors Actuators A Phys. 132 337 10.1016/j.sna.2006.04.024
16. M Strasser R Aigner C Lauterbach TF Sturm M Franosch G Wachutka 2004 Sensors Actuators A 114 362 10.1016/j.sna.2003.11.039
17. CJ Vineis A Shakouri A Majumdar MG Kanatzidis 2010 Adv. Mater. 22 3970 10.1002/adma.201000839 1:CAS:528:DC%2BC3cXhtF2mtrrM
18. O Bubnova ZU Khan A Malti S Braun M Fahlman M Berggren X Crispin 2011 Nat. Mater. 10 429 10.1038/nmat3012 1:CAS:528:DC%2BC3MXlsVGltr0%3D
19. KC See JP Feser CE Chen A Majumdar JJ Urban RA Segalman 2010 Nano Lett. 10 4664 10.1021/nl102880k 1:CAS:528:DC%2BC3cXht1CmtL%2FO
20. B Zhang J Sun HE Katz F Fang RL Opila 2010 ACS Appl. Mater. Interfaces 2 3170 10.1021/am100654p 1:CAS:528:DC%2BC3cXhtlyks7%2FF