Preparation of silver-coated copper powder and its oxidation resistance research

Powder Technology

Volumn 226, Issue , 2012, Pages 53-56

  Cao, Xiao Guo ^a   Zhang, Hai Yan ^a  

^a GUANGDONG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Copper powder; Copper specific extractant; Electroless; Oxidation resistance; Silver coating

Indexed keywords

CHELATE COMPOUNDS; CHELATING REAGENT; COPPER PARTICLES; ELECTROLESS; ELECTROLESS PLATING PROCESS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; EXTRACTANTS; OPTIMUM REACTION TEMPERATURE; ORGANIC PHASE; SILVER COATINGS; SILVER CONTENT; SILVER PARTICLES; SUBSTITUTION PLATING;

CHELATION; COATINGS; COPPER; COPPER POWDER; ELECTROLESS PLATING; OXIDATION RESISTANCE; SCANNING ELECTRON MICROSCOPY; SILVER PLATING; SUBSTITUTION REACTIONS; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

SILVER;

CHELATING AGENT; COPPER; CUPRIC ION; SILVER; SILVER NITRATE;

ARTICLE; MATERIAL COATING; MOLECULAR IMAGING; OXIDATION KINETICS; POWDER; REACTION TIME; ROENTGEN SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SUBSTITUTION REACTION; SURFACE PROPERTY; TEMPERATURE DEPENDENCE; X RAY DIFFRACTION;

EID: 84861898014     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2012.04.012     Document Type: Article

References (17)

1. Mamunya Y.P., Zois H., Apekis L., Lebedev E.V. Influence of pressure on the electrical conductivity of metal powders used as fillers in polymer composites. Powder Technology 2004, 140(1-2):49-55.
2. Lu Q.H., Hiroshi W. Study on a new type of conductive paste (1) study on a conductive paste of silver-plated copper powder. Journal of Functional Materials 1997, 28:546-549.
3. Kortschot M.T., Woodhams R.T. Electromagnetic interference shielding with nickel-coated mica composites. Polymer Composites 1985, 6(4):296-303.
4. Mamunya Y.P., Davydenko V.V., Pissis P., Lebedev E. Electrical and thermal conductivity of polymers filled with metal powders. European Polymer Journal 2002, 38(9):1887-1897.
5. Jiang G., Gilbert M., Hitt D.J., Wilcox G.D., Balasubramanian K. Preparation of nickel coated mica as a conductive filler. Composites Part A-Applied Science and Manufacturing 2002, 33(5):745-751.
6. Novak I., Krupa I., Chodak I. Electroconductive adhesives based on epoxy and polyurethane resins filled with silver-coated inorganic fillers. Synthetic Metals 2004, 144(1):13-19.
7. Park K.S., Son J.T., Chung H.T., Kim S.J., Lee C.H., Kang K.T., et al. Surface modification by silver coating for improving electrochemical properties of LiFePO4. Solid State Communications 2004, 129(5):311-314.
8. K. Masahito, N. TToru, Y. Yoshio, Y. Yoshifumi, N. Yoshito, Copper conductor paste and production method of copper conductor film. US Patent No 5,976,628. 1999.
9. Xue Y.Q., Gao B.J., Gao J.F. The theory of thermodynamics for chemical reactions in dispersed heterogeneous systems. Journal of Colloid and Interface Science 1997, 191(1):81-85.
10. Xu X.R., Luo X.J., Zhuang H.R., Li W.L., Zhang B.L. Electroless silver coating on fine copper powder and its effects on oxidation resistance. Materials Letters 2003, 57(24-25):3987-3991.
11. K. Noriaki, Y. Joei, M. Takeo, Process for the production of a silver coated copper powder and conductive coating composition. US Patent No 4,652,465. 1987.
12. T. Hayashi, Production of silver-coated copper-based powders. US Patent No 5,178,909 1993.
13. J. Li, X.J. Pan, S.D. You, S.X. Huang, Method for surface treating conductive copper powder with a treating agent and coupler[US Patent No 5,372,749. 1994.
14. Keuler J.N., Lorenzen L., Sanderson R.D., Prozesky V., Przybylowicz W.J. Characterization of electroless plated palladium-silver alloy membranes. Thin Solid Films 1999, 347(1-2):91-98.
15. D. Djokic, et al., Process for the production of silver coated particles. US Patent No 5,945,158. 1999.
16. Gao B.J., Jiang H.M., Zhang Z.X. Study on reaction mechanism of silver-plating for micro copper particle. Chinese Journal of Inorganic Chemistry 2000, 16:669-673.
17. Gao B.J., Gao J.F., Jiang H.M., Zhang Z.X. Plating structure and antioxygenation of micron Cu-Ag bimetallic powder. Acta Physico-Chimica Sinica 2000, 16:366-369.