Heat transport across metal-semiconductor (dielectric) structure under steady state conditions

International Journal of Heat and Mass Transfer

Volumn 55, Issue 15-16, 2012, Pages 4264-4268

  Gonzalez De La Cruz, G ^a   Gurevich, Yu G ^a  

^a DEPARTAMENTO DE FÍSICA   (Mexico)

Author keywords

Heat conduction in metals and semiconductors; Interface thermal conductivity; Steady state conditions

Indexed keywords

APPROXIMATION MODEL; ELECTRON MOMENTUM; ELECTRON PHONON; ENERGY RELAXATION; FERMI MOMENTA; HEAT DIFFUSION EQUATIONS; HEAT DIFFUSIONS; HEAT TRANSPORT; MICRO-ELECTRONIC DEVICES; PHONON SYSTEM; RELAXATION FREQUENCY; SIZE REDUCTIONS; STEADY-STATE CONDITION; TEMPERATURE APPROXIMATION; THERMAL BOUNDARY CONDUCTANCE; THERMAL DISSIPATION; TWO-MATERIALS; TWO-TEMPERATURE;

ELECTRON GAS; HEAT TRANSFER; METALS; MICROELECTRONICS; PARTIAL DIFFERENTIAL EQUATIONS; PHONONS;

THERMAL CONDUCTIVITY;

EID: 84861531800     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2012.03.068     Document Type: Article

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