Performance assessment of regularly structured Composite Latent Heat Storages for temporary cooling of electronic components

International Journal of Refrigeration

Volumn 35, Issue 4, 2012, Pages 1145-1155

  Lohse, Ekkehard ^a   Schmitz, Gerhard ^a  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Change of phase; Composite; Latent heat; Thermal conductivity; Thermal storage

Indexed keywords

CHANGE OF PHASE; COOLING OF ELECTRONICS; DIFFERENT SIZES; LOW THERMAL CONDUCTIVITY; MATERIAL PROPERTY; NEW DESIGN; PERFORMANCE ASSESSMENT; PHASE CHANGE MATERIAL (PCM); RELIABLE COOLING; TECHNICAL APPLICATIONS; THERMAL BEHAVIORS; THERMAL STORAGE;

COMPOSITE MATERIALS; HEAT STORAGE; LATENT HEAT; PHASE CHANGE MATERIALS; RATING;

THERMAL CONDUCTIVITY;

EID: 84861227813     PISSN: 01407007     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrefrig.2011.12.011     Document Type: Conference Paper

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