Self aggregation and solution behavior of copper and nickel based surfactants

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 403, Issue , 2012, Pages 103-109

  Mehta, S K ^a   Kaur, Ravneet ^a   Chaudhary, G R ^a  

^a PANJAB UNIVERSITY   (India)

Author keywords

Metallosurfactants; Micellization; Thermal behavior; Thermodynamic properties

Indexed keywords

COPPER; COPPER COMPOUNDS; CYCLIC VOLTAMMETRY; METAL IONS; MICELLIZATION; SURFACE TENSION; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

ALKYLAMMONIUM; AMPHIPHILIC MOLECULES; CMC VALUES; HEAD GROUPS; INTER-RELATIONSHIPS; METALLOSURFACTANTS; PHYSICOCHEMICAL STUDIES; PHYSICOCHEMICAL TECHNIQUES; SELF AGGREGATION; SELF-AGGREGATION PROPERTY; SOLUTION BEHAVIOR; SURFACE ACTIVE; SURFACTANT COMPLEXES; SURFACTANT PROPERTIES; THERMAL BEHAVIORS; ULTRASONIC SPEED;

SURFACE ACTIVE AGENTS;

COPPER; NICKEL; SURFACTANT;

ARTICLE; CHEMICAL STRUCTURE; COLLOID; CONDUCTANCE; CYCLIC POTENTIOMETRY; DENSITY; HYDROPHILICITY; HYDROPHOBICITY; INFRARED SPECTROSCOPY; MICELLE; PHYSICAL CHEMISTRY; PRIORITY JOURNAL; PROTON NUCLEAR MAGNETIC RESONANCE; SURFACE TENSION; SYNTHESIS; THERMOGRAVIMETRY; ULTRASOUND; VELOCITY;

EID: 84860918109     PISSN: 09277757     EISSN: 18734359     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2012.03.062     Document Type: Article

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