Modeling and simulation of electrostatic adhesion for wall climbing robot

2011 IEEE International Conference on Robotics and Biomimetics, ROBIO 2011

Volumn , Issue , 2011, Pages 2031-2036

  Koh, Keng Huat ^a   Kuppan Chetty, R M ^a   Ponnambalam, S G ^a  

^a MONASH UNIVERSITY MALAYSIA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED VOLTAGES; ELECTROSTATIC ADHESION; FRINGING FIELDS; GEOMETRICAL CONDITIONS; GEOMETRICAL PROPERTY; MATERIAL PROPERTY; MODELING AND SIMULATION; PAD MODELS; QUALITATIVE ADVANTAGES; STATIC FIELDS; SURFACE ATTACHMENT; WALL CLIMBING ROBOT; WALL SURFACES;

BIOMIMETICS; COMPUTER SIMULATION; ELECTROSTATICS; ROBOT APPLICATIONS; ROBOTICS;

ADHESION;

EID: 84860762043     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ROBIO.2011.6181590     Document Type: Conference Paper

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