Ink jet printing of conductive silver tracks from nanoparticle inks on mesoporous substrates

International Conference on Digital Printing Technologies

Volumn , Issue , 2011, Pages 437-440

  Schuppert, Anna ^a   Thielen, Moritz ^b   Reinhold, Ingo ^b   Schmidt, Wolfgang A ^a  

^a Felix Schoeller Jr   (Germany)

^b XaarJet AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL PARAMETERS; CRUCIAL PARAMETERS; DIFFERENT SUBSTRATES; HIGHER TEMPERATURES; IN-LINE; MESOPOROUS; METALLIC CONDUCTIVITY; METALLIC STRUCTURES; POROUS SUBSTRATES; POST PROCESSING; POST TREATMENT; SILVER NANOPARTICLES; SPECIFIC RESISTANCES; SURFACE GLOSS;

COATINGS; INK JET PRINTING; NANOPARTICLES; PORE SIZE; SILVER; SINTERING;

SUBSTRATES;

EID: 84860752622     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Shlomo Magdassi et al., Conductive Ink-Jet Inks for Plastic Electronics: Air Stable Copper Nanoparticles and Room Temperature Sintering. NIP25 and Digital Fabrication 2009 Technical Program and Proceedings (IS&T, Springfield, VA, 2009) pg. 611.
2. W. Schmidt, Choosing the Optimal Substrate Surface for Digital Fabrication Printing, NIP25 and Digital Fabrication 2009 Technical Program and Proceedings (IS&T, Springfield, VA, 2009) pg. 621.
3. Werner Zapka, Low Temperature Chemical Post-Treatment of Inkjet Printed Nano-Particle Silver Inks, NIP24 and Digital Fabrication 2008 Final Program and Proceedings, (IS&T, Springfield, VA, 2008), pg. 906.
4. Michael Grouchko et al., Conductive Ink-Jet Printing of Silver and Air-Stable Copper inks for Flexible and Plastic Electronics, LOPE-C 2011 Proceedings (OE-A, Frankfurt, Germany 2011), pg. 42.
5. Cauchois, R. et al., Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages. ESTC(IEEE, Berlin, Germany 2010), pg. 1-6.