-
1
-
-
50949086198
-
The evolution of water cooling for IBM large server systems: Back to the future
-
Orlando, FL, USA, May 28-31
-
Ellsworth, Jr., M.J., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., Chu, R.C., "The Evolution of Water Cooling for IBM Large Server Systems: Back to the Future," proceedings of the 2008 ITherm Conference, Orlando, FL, USA, May 28-31.
-
Proceedings of the 2008 ITherm Conference
-
-
Ellsworth Jr., M.J.1
Campbell, L.A.2
Simons, R.E.3
Iyengar, M.K.4
Schmidt, R.R.5
Chu, R.C.6
-
3
-
-
0023363798
-
Thermal management of air- and liquid cooled multi-chip modules
-
Bar-Cohen, A. "Thermal Management of Air- and Liquid Cooled Multi-Chip Modules," IEEE Trans. Components, Hybrids and Manufacturing Technology, Vol. 10, Issue 2, pp. 159-175.
-
IEEE Trans. Components, Hybrids and Manufacturing Technology
, vol.10
, Issue.2
, pp. 159-175
-
-
Bar-Cohen, A.1
-
4
-
-
0041435524
-
LSI packaging and cooling technologies for fujitsu VP2000 series
-
Kaneko, K. Seyama, K. and Suzuki, M. "LSI Packaging and Cooling Technologies for Fujitsu VP2000 Series,", Fujitsu Scientific & Technology Journal, v. 41, No. 1, 1990, pp. 12-19.
-
(1990)
Fujitsu Scientific & Technology Journal
, vol.41
, Issue.1
, pp. 12-19
-
-
Kaneko, K.1
Seyama, K.2
Suzuki, M.3
-
5
-
-
0026169583
-
Hardware technology for fujitsu VP2000 series
-
Kaneko, K., Kuwabara, K., Kikuchi, S. and Kano, T. "Hardware Technology for Fujitsu VP2000 Series," Fujitsu Scientific & Technology Journal, v. 37, No. 2, 1991, pp. 158-168.
-
(1991)
Fujitsu Scientific & Technology Journal
, vol.37
, Issue.2
, pp. 158-168
-
-
Kaneko, K.1
Kuwabara, K.2
Kikuchi, S.3
Kano, T.4
-
6
-
-
0026395818
-
Hardware technology for hitachi M-880 processor group
-
st Electronic Components and Technology Conference, 1991, pp. 693-703.
-
(1991)
st Electronic Components and Technology Conference
, pp. 693-703
-
-
Kobayashi, F.1
Watanabe, Y.2
Yamamoto, M.3
Anzai, A.4
Takahashi, A.5
Daikoku, T.6
Fujita, T.7
-
7
-
-
0022319774
-
Packaging technology for the NEC SX supercomputer
-
Watari, T.; Murano, H.," Packaging Technology for the NEC SX Supercomputer, "IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Volume 8, Issue 4, 1985, pp. 462-467
-
(1985)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.8
, Issue.4
, pp. 462-467
-
-
Watari, T.1
Murano, H.2
-
8
-
-
0026910785
-
Packaging technology for the NEC SX-3 supercomputers
-
Murano, H.; Watari, T., "Packaging technology for the NEC SX-3 Supercomputers," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Volume 15, Issue 4, 1992, pp. 411-417.
-
(1992)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.15
, Issue.4
, pp. 411-417
-
-
Murano, H.1
Watari, T.2
-
9
-
-
77953918683
-
Energy efficiency analyses and comparison of air and water cooled high performance servers
-
San Francisco, CA., July 19-23
-
Ellsworth Jr., M.J., "Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers," proceedings of the 2009 InterPACK Conference, San Francisco, CA., July 19-23.
-
Proceedings of the 2009 InterPACK Conference
-
-
Ellsworth Jr., M.J.1
-
10
-
-
84885328513
-
Analysis and design of the IBM power 575 supercomputing node cold plate assembly
-
San Francisco, CA, USA, July
-
Campbell, L.A., Ellsworth, Jr., M.J., Sinha, A., "Analysis and Design of the IBM Power 575 Supercomputing Node Cold Plate Assembly," proceedings of the 2009 InterPACK conference, San Francisco, CA, USA, July 19-23.
-
Proceedings of the 2009 InterPACK Conference
, pp. 19-23
-
-
Campbell, L.A.1
Ellsworth Jr., M.J.2
Sinha, A.3
-
11
-
-
84861688415
-
-
November 27
-
Morgan, T.M., "IBM Shows Off Power7 HPC Monster," The Register, November 27, 2009, (http://www.theregister.co.uk/2009/11/27/ibm-power7-hpc- server/).
-
(2009)
The Register
-
-
Morgan, T.M.1
-
12
-
-
84885311055
-
IBM finishes building ASCI purple super for DOE
-
July 24
-
CBR Staff Reporter, "IBM Finishes Building ASCI Purple Super for DOE," Computer Business Review, July 24, 2005, http://www.cbronline.com/ news/ibm-finishes-building-asci-purple-super-for-doe.
-
(2005)
Computer Business Review
-
-
-
13
-
-
84885299924
-
-
Canonsburg, PA 15317
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ANSYS CFX is a product of ANSYS, Inc. headquartered at 275 Technology Drive, Canonsburg, PA 15317 (http://www.ansys.com)
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Headquartered at 275 Technology Drive
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