Heat flow in SOI current mirrors

2003 International Semiconductor Device Research Symposium, ISDRS 2003 - Proceedings

Volumn , Issue , 2003, Pages 392-393

  Yu, Feixia ^a   Cheng, Ming C ^a  

^a Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; HEAT TRANSFER; MIRRORS; SEMICONDUCTOR DEVICES; SILICON ON INSULATOR TECHNOLOGY;

AGGRESSIVE REDUCTION; BULK TECHNOLOGIES; ELECTRONIC CHARACTERISTICS; LOW THERMAL CONDUCTIVITY; SELF-HEATING EFFECT; SENSITIVE STRUCTURE; TEMPERATURE DIFFERENCES; THERMAL COUPLING;

THERMAL CONDUCTIVITY;

EID: 84860228948     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISDRS.2003.1272150     Document Type: Conference Paper

References (7)

1. Silvaco Atlas user's manual, Device Simulation Software, 1996.
2. M.C. Cheng, F. Yu, Solid-Siaie Elecironics, in press.
3. B.M. Tenbroek R. John T. Bunyan, et al. IEEE Trans. Electron Devices, vol. 46, pp. 251-253, 1999.
4. L.T. Su, J.E. Chung, D.A. Antoniadis, et al. IEEE Trans. Electron Devices, vol. 41, pp. 69-75, 1994.
5. http://www-device.eecs.berkeley.edu/-bsimsoi.
6. K.E. Godson, M.I. Filk, IEEE Trans. Camp. Hybrids, Manufact. Technol., vol. 15, pp.715-722, 1992.
7. D. Chen, E. Li, E. Rosenbaum, et al, IEEE Tram. CAD of lCs and Sysiems, vol. 19, pp. 197-205 2000.