Thermal shock behavior of the SiC-SiC joints joined with Na 2O-B 2O 3-SiO 2 glass solder

Wuji Cailiao Xuebao/Journal of Inorganic Materials

Volumn 27, Issue 3, 2012, Pages 234-238

  Luo, Zhao Hua ^a,b   Jiang, Dong Liang ^a   Zhang, Jing Xian ^a   Lin, Qing Ling ^a   Chen, Zhong Ming ^a   Huang, Zheng Ren ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Glass solder; Joint; Residual strength; Thermal shock resistance

Indexed keywords

CRACKS PROPAGATION; FRACTURE SURFACES; QUENCHING TEMPERATURES; RESIDUAL STRENGTH; SIDE VIEW; SUBCRITICAL STATE; THERMAL CYCLE; THERMAL RESIDUAL STRESS; THERMAL SHOCK RESISTANCE; WATER-QUENCHING;

CRACKS; GLASS; JOINTS (STRUCTURAL COMPONENTS); SILICON CARBIDE; SODIUM; THERMAL SHOCK;

QUENCHING;

EID: 84859390105     PISSN: 1000324X     EISSN: None     Source Type: Journal    
DOI: 10.3724/SP.J.1077.2012.00234     Document Type: Article

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