SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 425, Issue 1-2, 2006, Pages 326-329

Thermal shock resistance of in situ reaction bonded porous silicon carbide ceramics

(3) Ding, Shuqiang a,b Zeng, Yu Ping a Jiang, Dongliang a

a SHANGHAI INSTITUTE OF CERAMICS (China)

b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES (China)

Author keywords

Porous SiC ceramics; Reaction bonding; Strength; Thermal shock resistance

Indexed keywords

BONDING; CERAMIC MATERIALS; CHEMICAL REACTIONS; CRACK PROPAGATION; HEAT RESISTANCE; IN SITU PROCESSING; POROUS MATERIALS; QUENCHING; STRENGTH OF MATERIALS;

IN SITU REACTION; POROUS SILICON CARBIDE; REACTION BONDING; RESIDUAL STRENGTH; SILICON CARBIDE CERAMICS; THERMAL SHOCK RESISTANCE;

SILICON CARBIDE;

BONDING; CERAMIC MATERIALS; CHEMICAL REACTIONS; CRACK PROPAGATION; HEAT RESISTANCE; IN SITU PROCESSING; POROUS MATERIALS; QUENCHING; SILICON CARBIDE; STRENGTH OF MATERIALS;

EID: 33744925929 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2006.03.075 Document Type: Article

Times cited : (94)

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