Dielectric thickness and ground width effect on multilayer coplanar components and circuits for ceramic multichip modules

Microwave and Optical Technology Letters

Volumn 54, Issue 5, 2012, Pages 1127-1132

  Samanta, K K ^a   Robertson, I D ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

Author keywords

ground plane width effect; microwave circuits; multichip modules; multilayer coplanar lumped elements; thick film technology

Indexed keywords

DIELECTRIC THICKNESS; EFFECTIVE DIELECTRIC CONSTANTS; EQUIVALENT CIRCUIT PARAMETER; LUMPED ELEMENT; MULTI-CHIP; MULTI-CHIP MODULE TECHNOLOGIES; MULTILAYER CONDUCTORS; THICK-FILM TECHNOLOGY; WIDTH EFFECTS;

CERAMIC MATERIALS; MICROWAVE CIRCUITS; MULTILAYERS; SCATTERING PARAMETERS; SWITCHING SYSTEMS;

MULTICHIP MODULES;

EID: 84859085251     PISSN: 08952477     EISSN: 10982760     Source Type: Journal    
DOI: 10.1002/mop.26759     Document Type: Article

References (11)

1. I.D. Robertson, and, S. Lucyszyn, RFIC and MMIC design and technology, IEE Publishing, London, 2001.
2. S. Todd, X.T. Huang, J.E. Bowers, and, N.C. MacDonald, Fabrication, modelling, and characterization of high-aspect-ratio coplanar waveguide, IEEE Trans Microwave Theory Tech 58 (2010), 260-267.
3. S-N Wang, and, N-W Chen, A compact, ultra-broadband coplanar-waveguide bandpass filter with simple open- and short-stub structures, Microwave Opt Technol Lett 52 (2010), 715-718.
4. R. Jackson, Mode conversion at discontinuities in Finite-width conductor-backed coplanar waveguide, IEEE Trans Microwave Theory Tech 37 (1989), 1582-1589.
5. K.K. Samanta, D. Stephens, and, I.D. Robertson, Design and development of a 60 GHz multi-chip module receiver employing substrate integrated waveguides, IEE Proc Microwaves, Antennas Propag 5 (2007), 961-967.
6. K.K. Samanta, and, I.D. Robertson, The effect of dielectric height and ground plane width on multilayer MCM FGCPW lumped elements, European Microwave Conference, Amsterdam, Holland, Oct. 2008.
7. K.K. Samanta, and, I.D. Robertson, Advanced multilayer thick-film system-on-package technology for miniaturized and high performance CPW microwave passive components, IEEE Trans Adv Packag (in press).
8. D. Stephens, P.R. Young, I.D. Robertson, Millimeter-wave substrate integrated waveguides and filters in photoimageable thick-film technology, IEEE Trans Microwave Theory Tech 99 (2005), 1-7.
9. K.K. Samanta, D. Stephens, and, I.D. Robertson, Ultrawideband characterisation of photoimageable thick film materials for microwave and millimetre-wave design, IEEE MTTS, IMS2005, Long Beach, 11-17 June, CD ROM.
10. I.D. Robertson, and, K.K. Samanta, Advanced photoimageable thick film technology for 60 GHz system-in-package modules, Asia-Pacific Microwave Proceedings, APMC 2008, Dec. 2008.
11. D.M. Pozar, Microwave engineering, Wiley, Hoboken, NJ, 2005.