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Volumn 17, Issue 4, 2012, Pages 42-46

The microstructure and mechanical properties of as-cast Sn-Sb-Zn lead free solder alloys

Author keywords

EDS; Hardness; Microstructure; SEM; Tensile

Indexed keywords


EID: 84858613226     PISSN: 15822214     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (11)
  • 2
    • 77952914439 scopus 로고    scopus 로고
    • Ispitivanje strukturnih i mehaničkih karakteristika nekih bezolovnih lemnih legura na bazi bakakalaj sistema
    • ISSN 0367-598X
    • Aleksandra Mitkovski, Ljubiša Balanović, Dragana Živković, Saša Marjanović, Bata Marjanović, Sladjana Novaković, Ispitivanje strukturnih i mehaničkih karakteristika nekih bezolovnih lemnih legura na bazi bakakalaj sistema, Hemijska industrija, 62 3 (2008) 160-163 ISSN 0367-598X
    • (2008) Hemijska Industrija , vol.62 , Issue.3 , pp. 160-163
    • Mitkovski, A.1    Balanović, L.2    Živković, D.3    Marjanović, S.4    Marjanović, B.5    Novaković, S.6
  • 4
  • 5
    • 33845763844 scopus 로고    scopus 로고
    • Lowering of Snb alloy melting points caused by substrate dissolution
    • ISSN 0361-5235
    • Sinn Wen Chen, Po Yin Chen, Chao Hong Wang, Lowering of Snb alloy melting points caused by substrate dissolution, Journal of Electronic Materials, 35, 11 2006 1983-1986, ISSN 0361-5235
    • (2006) Journal of Electronic Materials , vol.35 , Issue.11 , pp. 1983-1986
    • Chen, S.W.1    Po, Y.C.2    Wang, C.H.3
  • 8
    • 15544376278 scopus 로고    scopus 로고
    • Investigations on microhardness of Sn-Zn based leadfree solder alloys as replacement of Sn-Pb solder
    • ISSN 0925-8388
    • R.A. Islam, B.Z. Wu, M.O. Alam, Y.C. Chan, W. Jillek, Investigations on microhardness of Sn-Zn based leadfree solder alloys as replacement of Sn-Pb solder, Journal of Alloys and Compounds, 392 1-2 (2005) 149-158 ISSN 0925-8388
    • (2005) Journal of Alloys and Compounds , vol.392 , Issue.1-2 , pp. 149-158
    • Islam, R.A.1    Wu, B.Z.2    Alam, M.O.3    Chan, Y.C.4    Jillek, W.5
  • 9
    • 33845688716 scopus 로고    scopus 로고
    • Sn-Zn. low temperature solder
    • ISSN 0957-4522
    • Katsuki Suganuma, Kuen-Soo Kim, Sn-Zn. low temperature solder, J. Mater. Sci: Mater Electron 18 1-3 (2007) 121-127 ISSN 0957-4522
    • (2007) J. Mater. Sci: Mater Electron , vol.18 , Issue.1-3 , pp. 121-127
    • Suganuma, K.1    Kim, K.S.2
  • 10
    • 0037464016 scopus 로고    scopus 로고
    • Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys
    • ISSN 0925-8388
    • Young Sun Kim, Keun Soo Kim, Chi Won Hwang, Katsuaki Suganuma, Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys, Journal of Alloys and Compounds, 352 1-2 (2003) 237-245 ISSN 0925-8388
    • (2003) Journal of Alloys and Compounds , vol.352 , Issue.1-2 , pp. 237-245
    • Kim, Y.S.1    Kim, K.S.2    Hwang, C.W.3    Suganuma, K.4
  • 11
    • 77953138466 scopus 로고    scopus 로고
    • Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
    • ISSN 0925-8388
    • Bo In Noh, Jung Hyun Choi, Jeong Won Yoon, Seung Boo Jung, Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys, Journal of Alloys and Compounds 499 2 (2010) 154-159 ISSN 0925-8388
    • (2010) Journal of Alloys and Compounds , vol.499 , Issue.2 , pp. 154-159
    • Bo, I.N.1    Choi, J.H.2    Yoon, J.W.3    Jung, S.B.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.